Non-volatile storage device

ABSTRACT

A non-volatile storage device ( 1 ) has non-volatile memory units (FARY 0  to FARY 3 ), buffer units (BMRY 0  to BMRY 3 ) and a control unit (CNT), and the control unit can control a first access processing between an outside and the buffer unit and a second access processing between the non-volatile memory unit and the buffer unit upon receipt of directives from the outside separately from each other. The control unit can independently carry out an access control over the non-volatile memory unit and the buffer unit in accordance with the directives sent from the outside, respectively. Therefore, it is possible to set up next write data to the buffer unit simultaneously with the erase operation of the non-volatile memory unit or to output once read storage information to the buffer unit at a high speed as in a cache memory operation in accordance with the directive sent from the outside. Consequently, it is possible to reduce the overhead of a data transfer for reading/writing data from/to the non-volatile storage device.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from PCT internationalapplication PCT/JP02/11953 filed on Nov. 15, 2002, the content of whichis hereby incorporated by reference into this application.

BACKGROUND OF THE INVENTION

The present invention relates to a non-volatile storage device having anon-volatile memory unit and a buffer unit thereof, and to an effectivetechnology for an application to a flash memory having a multibank, forexample.

BACKGROUND ART

JP-A-11-85609 has described a flash memory having a non-volatile memoryunit and a buffer unit thereof. According to the publication, the memoryunit can carry out read/write only on a unit of 8 bits or 16 bits, whileit is necessary to exchange data on a unit of a single or pluralsector(s) such as 512 bytes together with a host device, and therefore,the buffer unit is provided and utilized as a cache memory. The bufferunit to be utilized as the cache memory is simply used tacitly in aninner part when a command such as an erase, a program (hereinafterreferred to also as a write) or a read for the flash memory is to beexecuted. In short, the buffer unit is not intended for a directoperation from the outside of the flash memory. In this respect, theinventor made considerations and found the following matters. First ofall, the utilization of the buffer unit is not originally required in anerase operation for the non-volatile memory unit and cannot be appliedto other uses. For this reason, an on-chip buffer unit cannot beeffectively used practically during the erase operation. Moreover, theoperation cannot be carried out in such a manner that storageinformation stored once in the buffer unit is to be read to an outsideat a high speed independently of the operation of the non-volatilememory unit. In relation thereto, JP-A-6-259320 and JP-A-11-149788 havedescribed a non-volatile storage device comprising a non-volatile memoryunit and a buffer unit for holding data from an outside and serving tocarry out such a control as to utilize the buffer unit as a cachememory. For a non-volatile storage device having a multibank, however,the inventor has found that there is room for further reducing theoverhead of a data transfer between the outside and the flash memory inorder to increase the speed of an access operation.

It is an object of the invention to provide a non-volatile storagedevice capable of effectively using a buffer unit practically during anerase operation for a non-volatile memory unit.

It is another object of the invention to provide a non-volatile storagedevice capable of quickly reading storage information read from thenon-volatile memory unit and retained in the buffer unit to an outsideindependently of the operation of the non-volatile memory unit.

It is a further object of the invention to provide a non-volatilestorage device capable of reducing the overhead of a data transferbetween the outside and the no-volatile memory unit.

The above and other objects and novel features of the invention will beapparent from the following description of the specification and theaccompanying drawings.

SUMMARY OF THE INVENTION

[1] <<Independent Access Control>> A non-volatile storage deviceaccording to the invention has a plurality of banks (BNK0 to BNK3) and acontrol unit (CNT), wherein the banks (BNK0 to BNK3) have non-volatilememory units (FARY0 to FARY3) and buffer units (BMRY0 to BMRY3)corresponding thereto. The non-volatile memory unit of each bank can becaused to carry out an access operation independently. The control unitcan carry out a control upon receipt of a directive (22, 23) of a firstaccess processing between an outside and the buffer unit and a directive(21, 24) of a second access processing between the non-volatile memoryunit and the buffer unit from the outside separately from each other.The first access processing includes an access to one buffer unit, andthe second access processing includes an access to one non-volatilememory unit and an access to a plurality of non-volatile memory unitsand can be caused to select either of the accesses.

As described above, the control unit can carry out the access controlover the non-volatile memory unit having a multibank and the buffer unitindependently in accordance with the directives sent from an outside,respectively. Therefore, the non-volatile memory unit and the bufferunit can be operated in parallel and storage information read once ontothe buffer unit can be output at a high speed as in the operation of acache memory in accordance with a directive sent from the outside.Consequently, it is possible to reduce the overhead of a data transferfor reading/writing data from/to the non-volatile storage device havingthe multibank.

<<First Access Processing>> In a specific manner according to theinvention, the directive of the first access processing serves to store(hereinafter referred to also as a write) data input from the outside tothe buffer unit or to read data from the buffer unit to the outside. Thedirective for writing or the directive for reading is given by a changein one or a plurality of control signals (CLE, ALE, WEb, REb) input fromthe outside, for example. More specifically, the directive for writingis given in a write enable state in command latch disable and addresslatch disable. Moreover, the directive for reading is given in a readenable state in the command latch disable and the address latch disable.The state of a control signal such as the single or plural strobesignals can also be regarded as a command code. It is also possible toemploy a different command code from the strobe signal for the directiveof the first access processing.

In a specific manner according to the invention, state directiveinformation (R/Bb) for indicating that the second access processing isbeing carried out is output to the outside. It is possible to easilycontrol the directive timing of the read enable or the write enablewhich is sent from the outside.

<<Second Access Processing>> In a specific manner according to theinvention, the directive of the second access processing is given inaccordance with an access command. The access command has a first accesscommand for giving a directive to read data from the buffer unit and towrite the data to the non-volatile memory unit, a second access commandfor giving a directive to read the data from the non-volatile memoryunit and to write the data to the buffer unit, or a third access commandfor giving a directive to erase the data of the non-volatile memoryunit. In the invention, a word of write can be replaced with a word ofstore when a volatile memory unit such as a buffer unit is caused tohold information, and furthermore, can be replaced with a word ofprogram when the non-volatile memory unit is caused to hold theinformation.

<<Plural Memory Banks>> In a specific manner according to the invention,the non-volatile memory unit and the buffer unit are caused tocorrespond to each other and plural sets of correspondences are providedas memory banks.

<<Address Command>> An address command (20) is employed for specifyingan access address at this time, for example. The control unit canrecognize an address command supplied from the outside, and the addresscommand can specify a storage region of the buffer unit and a storageregion of the non-volatile memory unit.

As a specific example, the address command can have first specificationinformation, second specification information and third specificationinformation. The first specification information specifies anon-volatile memory unit and tacitly specifies a buffer unitcorresponding to the non-volatile memory unit thus specified. The secondspecification information specifies an accessing object address in thenon-volatile memory unit which is specified. The third specificationinformation specifies an accessing object address in the buffer unitwhich is specified.

Attention is paid to the utilization efficiency of the buffer unit.While the buffer unit can be specified freely in the first accessprocessing, the buffer unit corresponding to the non-volatile memoryunit is specified tacitly in the second access processing. In order toexpand the specification, it is preferable that the control unit shouldregard the specification of the buffer unit based on the firstspecification information as the specification of another buffer unitwhich does not correspond to the non-volatile memory unit whenresponding to the specific directive of the second access processing.

<<Parallelization of First Access Processing and Second AccessProcessing>> In a specific manner according to the invention, thecontrol unit can carry out the second access processing of thenon-volatile memory unit and the first access processing of anotherbuffer unit which does not correspond to the non-volatile memory unit atthe same time depending on the directive states of the first and secondaccess processings. Moreover, the control unit can carry out an eraseprocessing of the non-volatile memory unit and the first accessprocessing of the buffer unit at the same time. For example, during theerase operation of the non-volatile memory unit, write data are input tothe buffer unit corresponding to the non-volatile memory unit. In short,during the access operation of the non-volatile memory unit, data to beused next are input to the buffer unit on a background thereof.

<<Maintenance of Storage Data of Buffer Unit>> When taking a differentviewpoint of the parallelization of the access processing, the controlunit maintains storage information of the buffer unit in such a state asto carry out a processing of responding to a directive of the secondaccess processing of reading data from the buffer unit and writing thedata to the non-volatile memory unit and to then wait for anotherdirective of the first access processing or the second accessprocessing. In the case in which the storage information held by thebuffer unit are to be copied onto another place of the non-volatilememory unit or a retrial for a write error is to be carried out,consequently, the invention is convenient. Moreover, the control unitmaintains storage information of the buffer unit in such a state as tocarry out a processing of responding to a directive of the first accessprocessing of reading data from the buffer unit and outputting the datato an outside and to then wait for another directive of the first accessprocessing or the second access processing. Consequently, the storageinformation read once to the buffer unit can be output at a high speedas in the operation of a cache memory in accordance with a directivesent from the outside.

The control unit initializes storage information of the buffer unit inaccordance with a buffer clear command in such a manner that unnecessarydata can be deleted when the storage information is to be maintained inthe buffer unit. In order to prevent unnecessary data remaining in thebuffer unit from being written erroneously in the write, moreover, thestorage information of the buffer unit is initialized before the writeof data input from the outside to the buffer unit when the write is tobe carried out in response to the first access processing.

<<Read Cache Operation of Buffer Unit>> In a specific manner accordingto the invention, the control unit can transfer data read from thenon-volatile memory unit and written to the buffer unit through thesecond access processing at plural times in a different timing from thebuffer unit to the outside through the first access processing to becarried out at plural times which is designated from the outside.Consequently, the buffer unit can be caused to carry out a read cacheoperation by a control sent from the outside.

Moreover, the control unit omits a second access processing of writingdata from the non-volatile memory unit to the buffer unit which sets thesame address as that on the non-volatile memory unit of data retained inthe buffer unit to be an access processing object when a directive ofthe second access processing is given. Consequently, the non-volatilestorage device can carry out an address comparison by itself, therebycausing the buffer unit to perform the read cache operation. For theaddress comparing operation, for example, there are provided addressholding means for holding address information about an address on thenon-volatile memory unit of the data retained in the buffer unit, andcomparing means for comparing the address information held in theaddress holding means with address information about an address of thenon-volatile memory unit which is set to be a data reading object in thesecond access processing.

The read cache operation control of the buffer unit by the control unitis equivalent to a control for varying a period of a busy state based ona signal indicating, as the busy state, that the second accessprocessing is being carried out depending on presence of the omission ofthe second access processing when a directive for outputting datawritten from the non-volatile memory unit to the buffer unit in thesecond access processing from the buffer unit to the outside is giventhrough the first access processing.

<<Copy and Rewrite of Utilization of Buffer Unit>> In a specific manneraccording to the invention, the control unit can write data written fromthe outside to the buffer unit by the first access processing at pluraltimes from the buffer unit to the non-volatile memory unit through thesecond access processing carried out at plural times. Consequently, itis possible to efficiently carry out copy and write retrial processings.

<<Decision of Write Data over Buffer Unit>> In a specific manneraccording to the invention, the control unit can write data rewrittenfrom the outside onto the buffer unit by the first access processingcarried out at plural times from the buffer unit to the non-volatilememory unit through the second access processing. For example, aprocessing efficiency can be enhanced when a read/modify/write operationis to be repeated many times for the same sector data.

<<Binary Mode>> In a specific manner according to the invention, thenon-volatile memory unit can store multivalued information of 2 bits ormore in one storage element and the buffer unit can store binaryinformation of 1 bit in one storage element. At this time, the controlunit can regard storage information of the non-volatile memory unit asbinary information and can control a third access processing of omittinga converting operation from a multivalue to a binary. Consequently, atime required for reading data to an outside is shortened. If the objectof the third access processing is set to be management domain data forthe sector of file data, for example, it is possible to quickly decidethe presence of the validity or alternative of a sector, therebycontributing to an increase in the speed of a file access.

<<Independent Clock Generation>> In a specific manner according to theinvention, there is provided, on a signal path to be used for the firstaccess processing, an address buffer for latching address informationsent from the outside, a buffer unit address buffer for inputting anoutput of the address buffer and supplying the output to the bufferunit, a buffer unit data buffer for latching data output from the bufferunit, and a data buffer for latching data output from the buffer unitdata buffer and outputting the data to the outside. Attention is paid tothe structure in which a comparatively large number of pipeline stagesfrom the address input to the data output are provided. At this time,the control unit independently generates a clock and creates a latchtiming of the buffer unit address buffer and a latch timing of thebuffer unit data buffer while an address command is recognizedsynchronously with a first strobe signal and a second strobe signal forgiving a directive to read data to the outside in the first accessprocessing is then changed. Even if the number of the pipeline stagesfrom the address input to the data output is comparatively large, acountermeasure can be taken.

<<Rewrite Operation>> In a specific manner according to the invention,when there are provided plural sets of non-volatile memory units andbuffer units corresponding to each other, an erase unit of thenon-volatile memory unit is plural times as large as a write unit andeach of the buffer units has a storage capacity on the write unit, thecontrol unit uses both the non-volatile memory unit to be a rewriteobject and the buffer unit of a different non-volatile memory unit in asave region of rewrite object storage information corresponding to adirective of a rewrite operation for storage information on the eraseunit. Also in the case in which an erase unit for the non-volatilememory unit is greater than a write unit, consequently, the rewrite canbe carried out.

<<LSI>> In a specific manner according to the invention, thenon-volatile storage device is constituted as a memory LSI formed on onesemiconductor chip, a microcomputer LSI formed on one semiconductor chiptogether with other circuit modules such as a CPU or a system LSI.

[2] <<Independent Access Control>> A non-volatile storage deviceaccording to another aspect of the invention comprises a plurality ofmemory banks (BNK0 to BNK3) and a control unit (CNT), and the memorybanks have non-volatile memory units (FARY0 to FARY3) and buffer units(BMRY0 to BMRY3). Accessing object regions of the buffer unit and thenon-volatile memory unit are specified based on an address command (20).The control unit can carry out a control upon receipt of a directive(22, 23) of a first access processing between an outside and the bufferunit and a directive (21, 24) of a second access processing between thenon-volatile memory unit and the buffer unit from the outside separatelyfrom each other. Furthermore, the control unit can control one of thefirst access processing corresponding to one of the second accessprocessing and can control a plurality of the first access processingscorresponding to one of the second access processing.

As described above, the control unit can carry out an access controlover the non-volatile memory unit and the buffer unit independently inaccordance with directives sent from an outside, respectively.Therefore, the non-volatile memory unit and the buffer unit can beoperated in parallel and storage information read once onto the bufferunit can be output at a high speed as in the operation of a cache memoryin accordance with a directive sent from the outside.

The control unit is caused to utilize the buffer unit of the memory bankspecified in accordance with the address command in the first accessprocessing, and can freely specify the buffer unit in the first accessprocessing. In the second access processing, the control unit is causedto utilize the buffer unit of the memory bank specified in accordancewith the address command or the buffer unit of another memory bankcorresponding to contents of a directive in the second accessprocessing.

<<Multibank Read>> In a specific manner according to the invention, thecontrol unit controls a read set-up operation for the accessing objectregion of the non-volatile memory unit specified in accordance with anaddress command every time the address command is input within a limitof the number of times of a dependence on the number of the memorybanks, and controls to read storage information from the non-volatilememory unit subjected to the read set-up and to write the storageinformation to the buffer unit when a read access command for giving adirective of a read operation as the second access processing is input.Consequently, it is possible to carry out a read operation for amultibank.

<<Multibank Write>> In a specific manner according to the invention, thecontrol unit controls a write operation for write data to the bufferunit of the memory bank specified in accordance with an address commandevery time the address command is input and write data are input inaccordance with a directive of the first access processing continuouslywithin a limit of the number of times of a dependence on the number ofthe memory banks, and carries out a control to write the write datapossessed by the buffer unit to the non-volatile memory unit of thecorresponding memory bank when a write access command for giving adirective of the write operation as the second access processing isinput. Consequently, it is possible to carry out a write operation for amultibank.

<<Multibank Erase>> In a specific manner according to the invention, thecontrol unit controls an erase operation of a storage region for thenon-volatile memory unit of the memory bank specified in accordance withan address command by inputting the address command and then inputtingan erase command continuously within a limit of the number of times of adependence on the number of the memory banks. Consequently, it ispossible to carry out an erase operation for a multibank.

[3] <<Independent Access Control>> A non-volatile storage deviceaccording to a further aspect of the invention has a control unit, anon-volatile storage unit and a buffer circuit, the non-volatile storageunit being divided into a plurality of non-volatile storage regions, andthe buffer circuit being divided into a plurality of buffer regionscorresponding to the non-volatile storage regions. The control unitaccepts a plurality of operation directive commands from an outside. Theoperation directive commands have a first operation directive command(22, 23) for giving a directive of an access operation between thebuffer circuit and the outside and a second operation directive command(21, 24) for giving a directive of an access operation between thebuffer circuit and the non-volatile storage unit. The first operationdirective command can give a directive of an access operation to thebuffer region, and the second operation directive command can selecteither an access operation to one of the non-volatile storage region oran access operation to a plurality of the non-volatile storage regions,thereby giving a directive.

The control unit has a command accepting state capable of accepting theoperation directive command, and accepts the operation directive commandto carry out a processing corresponding to each operation directivecommand and then brings the command accepting state.

<<Address Command>> In a specific manner according to the invention, thenon-volatile storage unit is divided into a plurality of storageregions, the operation directive command has a third operation directivecommand (20) for specifying an address to select one of the storageregions of the non-volatile storage unit, and the second operationdirective command gives a directive to carry out an access operationbetween the storage region of the non-volatile storage unit which isselected in accordance with the third operation directive command andthe buffer circuit.

<<Multibank>> The buffer circuit is divided into a plurality of regionscorresponding to the storage regions. At this time, the control unitselects the storage region of the non-volatile storage unit inaccordance with the third operation directive command and also selectsthe region of the buffer circuit corresponding to the storage region ofthe non-volatile storage unit thus selected. The first operationdirective command gives a directive for carrying out an access operationbetween the region of the buffer circuit selected in accordance with thethird operation directive command and the outside. The second operationdirective command gives a directive for carrying out an access operationbetween the region of the buffer circuit and the storage region of thenon-volatile storage unit which are selected in accordance with thethird operation directive command.

<<Parallelization Processing of Multibank>> The control unit is broughtinto the command accepting state corresponding to a completion of a partof the access processing to one of the storage regions of thenon-volatile storage unit in accordance with the second operationdirective command, and before all the access processings to one of thestorage regions are completed, can carry out an acceptance of the thirdoperation directive command, and an acceptance of the first or secondoperation directive command when the buffer circuit region and thestorage region of the non-volatile storage unit which are selected inaccordance with the third operation directive command are different fromthe region in which the access processing is carried out.

<<Write/Read Operation Directive Command>> The first operation directivecommand includes a first write operation command for giving a directiveto write data to the buffer circuit and a first read operation commandfor giving a directive to read data from the buffer circuit, forexample. The second operation directive command includes a second writeoperation command for giving a directive to write data from the buffercircuit to the non-volatile storage unit and a second read operationcommand for giving a directive to read data from the non-volatilestorage unit to the buffer circuit, for example.

<<Erase Operation Directive Command>> The first operation directivecommand further includes a first erase operation command for giving adirective to erase data written to the buffer circuit. The secondoperation directive command further includes a second erase operationcommand for giving a directive to erase data written to the non-volatilestorage unit.

<<Command Acceptance parallelized with Erase>> After accepting the thirdoperation directive command for specifying a first storage region of thenon-volatile storage unit and then accepting the second erase operationcommand, and starting to erase data written to the first storage regionand before completing the erase of the data, it is possible to acceptthe third operation directive command for specifying a second storageregion of the non-volatile storage unit and the first operationdirective command or the second operation directive command.

<<Decision of Write Data over Buffer Circuit>> After accepting the thirdoperation directive command for specifying a first storage region of thenon-volatile storage unit and then accepting the second read command,and completing to read data from the non-volatile storage unit to thebuffer circuit, it is possible to accept the first operation directivecommand at least once, and furthermore, to carry out an operation foraccepting the second write command.

<<Parallelization Processing>> After accepting the second read commandand before accepting the second write command, it is possible to carryout an acceptance of the third operation directive command forspecifying a second storage region of the non-volatile storage unit andan acceptance of the first operation directive command or the secondoperation directive command at least once and to then carry out anoperation for accepting the third operation directive command forspecifying the first storage region.

<<Decision of Write Data over Buffer Circuit>> It is possible to carryout an operation for accepting the second write command after acceptingthe third operation directive command for specifying the first storageregion of the non-volatile storage unit and then accepting the firstwrite command at least once. It is possible to carry out an operationfor accepting the first operation directive command at least once afteraccepting the first write command at least once. It is possible to carryout the operation for accepting the second write command at least onceafter accepting the write command at least once.

<<Cache Operation of Buffer Circuit>> It is possible to accept thesecond read command after accepting the third operation directivecommand for specifying a first address included in the first storageregion of the non-volatile storage unit, and to read data in a firstdata volume from an address specified in accordance with the thirdoperation directive command from the non-volatile storage unit to thebuffer circuit in accordance with the second read command, and to thenaccept, at least once, the third operation directive command and thefirst operation directive command which specify an address included inthe first storage region of the non-volatile storage unit and containedin a range of the first data volume from the first address.

<<Cache Operation of Buffer Circuit>> When accepting the second readcommand after accepting the third operation directive command forspecifying a first address included in the first storage region of thenon-volatile storage unit, reading data in a first data volume from anaddress specified in accordance with the third operation directivecommand from the non-volatile storage unit to the buffer circuit inaccordance with the second read command, and further accepting the thirdoperation directive command which specifies a second address included inthe first storage region of the non-volatile storage unit and containedin a range of the first data volume from the first address, andaccepting the second read command, a read operation from thenon-volatile storage unit to the buffer circuit is not carried out in aprocessing of the second read command.

<<Hold of Storage Information of Buffer Circuit>> Data written to thebuffer circuit are not erased in a completion of the second writecommand but the data written to the buffer circuit are erased inaccordance with the first erase operation command.

<<Utilization of Non-Preferential Corresponding Buffer Circuit>> Thebuffer circuit is divided into a plurality of regions corresponding tothe storage regions, and has a first region of a buffer circuit whichpreferentially corresponds to a first storage region and a second regionof a buffer circuit which preferentially corresponds to a second storageregion. An access operation can be carried out in the first region ofthe buffer circuit together with the second storage region. The accessoperation can also be carried out in the second region of the buffercircuit together with the first storage region.

<<Utilization of Non-Preferential Corresponding Buffer Circuit>> Thefirst operation directive command includes a first write operationcommand for carrying out an access operation between the first region ofthe buffer circuit and the outside to give a directive to write data tothe buffer circuit, a first read operation command for giving adirective to read data from the buffer circuit, and a first eraseoperation command for giving a directive to erase data written to thebuffer circuit. The second operation directive command includes a secondwrite operation command for carrying out an access operation between theregion of the buffer circuit selected in accordance with the thirdoperation directive command and the storage region of the non-volatilestorage unit to give a directive to write data from the buffer circuitto the non-volatile storage unit, a second read operation command forgiving a directive to read data from the non-volatile storage unit tothe buffer circuit, and a second erase operation command for giving adirective to erase data written to the non-volatile storage unit. Thesecond write operation command has a main second write operation commandfor giving a directive to write data to the storage region whichpreferentially corresponds to the region of the buffer circuit which isselected, and a subordinate second write operation command for giving adirective to write data to a storage region which is not the storageregion preferentially corresponding to the region of the buffer circuitwhich is selected. The second read operation command has a main secondread operation command for giving a directive to read data from thestorage region which preferentially corresponds to the region of thebuffer circuit which is selected, and a subordinate second readoperation command for giving a directive to read data from a storageregion which is not the storage region preferentially corresponding tothe region of the buffer circuit which is selected.

<<Rewrite Operation>> Data are read or written at a time on a first datavolume unit in accordance with the second read command or the secondwrite command. Data are erased at a time on a unit of a second datavolume which is larger than the first data volume in accordance with thesecond erase command. When a first address is to be specified inaccordance with the third operation directive command and a directive ofthe second erase command is to be given, first data included in anaddress range having the first data volume from the first address arewritten to the storage region preferentially corresponding to the regionof the buffer circuit which is selected or/and second data sent from asecond address which is not included in the address range having thefirst data volume from the first address are written to the storageregion which is not the storage region preferentially corresponding tothe region of the buffer circuit which is selected.

[4] <<Independent Access Control>> A non-volatile storage deviceaccording to a further aspect of the invention has a control unit and anon-volatile storage unit. The non-volatile storage unit has a pluralityof storage regions. There are provided the same number of buffercircuits as the number of the storage regions, and the respective buffercircuits are connected to an outside and are caused to correspond to therespective storage regions, and the buffer circuits can be accessed tothe outside independently based on a control to be carried out by thecontrol unit, respectively. At least one of the storage regions cancarry out an access operation independently together with thecorresponding buffer circuit based on the control to be carried out bythe control unit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing the planar layout structure of a flashmemory according to an example of a semiconductor storage deviceaccording to the invention.

FIG. 2 is a block diagram illustrating the details of transmitting pathsfor an address, data and a command code in a flash memory 1.

FIG. 3 is an explanatory diagram illustrating a data transferconfiguration between external input/output terminals i/o0 to i/o7 and abuffer memory.

FIG. 4 is an explanatory diagram illustrating a data transferconfiguration between a buffer memory and a flash.

FIG. 5 is an explanatory diagram illustrating the type of an accessprocessing in the flash memory.

FIG. 6 is an explanatory diagram schematically illustrating directiveconfigurations for a first access processing and a second accessprocessing.

FIG. 7 is an explanatory diagram showing a specific example of a commandarchitecture in the flash memory.

FIG. 8 is an explanatory diagram showing an operation, typicallyillustrating the contents of a clear processing based on a buffer clearcommand.

FIG. 9 is an explanatory diagram showing an operation, typicallyillustrating the contents of a write or read processing for any of pages1 to 4.

FIG. 10 is an explanatory diagram illustrating a preferentialcorrespondence relationship and a non-preferential correspondencerelationship of the buffer memory for a flash memory array.

FIG. 11 is an explanatory diagram typically showing the contents of a4-page write or read processing.

FIG. 12 is an explanatory diagram typically showing the contents of anerase processing for any of pages 2 to 8.

FIG. 13 is an explanatory diagram typically showing the contents of an8-page erase processing.

FIG. 14 is an explanatory diagram typically showing the contents of adirect flash access processing.

FIG. 15 is a state transition diagram showing a control state forresponding to an address command and the directives of first and secondaccess processings.

FIG. 16 is an explanatory diagram showing a rewrite operation for theflash memory.

FIG. 17 is an explanatory diagram showing a rewrite operation utilizing,for a data save, a corresponding buffer memory and a non-correspondingbuffer memory in a memory bank.

FIG. 18 is an explanatory diagram showing another rewrite operation forthe flash memory.

FIG. 19 is an explanatory diagram showing a cache read operation for theflash memory.

FIG. 20 is an explanatory diagram showing an example of the case inwhich the decision of a page address hit and a page address miss hit forthe cache read operation for the flash memory is carried out by theflash memory.

FIG. 21 is an explanatory diagram illustrating a copy write operation.

FIG. 22 is a timing chart showing a read operation.

FIG. 23 is a timing chart showing a cache read operation.

FIG. 24 is a timing chart showing a write operation.

FIG. 25 is a timing chart showing a copy write operation.

FIG. 26 is a timing chart showing an operation corresponding to theprocessing in FIG. 19 in which a memory controller carries out a pageaddress comparison for the cache read operation.

FIG. 27 is a timing chart showing an operation corresponding to theprocessing in FIG. 20 in which the flash memory carries out the pageaddress comparison for the cache read operation.

FIG. 28 is an explanatory diagram showing the pipeline of a data outputsystem in the flash memory.

FIG. 29 is a timing chart illustrating each output signal waveform inthe pipeline of FIG. 28.

FIG. 30 is an explanatory diagram schematically illustrating abackground data input operation.

FIG. 31 is a timing chart illustrating a difference between a writeoperation utilizing the background data input and a write operationutilizing no background data input.

FIG. 32 is an explanatory diagram illustrating the more detailed conceptof the background data input.

FIG. 33 is a timing chart showing erase and write operations which applya background data input operation.

FIG. 34 is an explanatory diagram illustrating the data input operationof the buffer memory in the background data input operation in FIG. 33.

FIG. 35 is an explanatory diagram illustrating the operation state ofthe buffer memory and the flash memory array in the background datainput operation in FIG. 33.

FIG. 36 is a timing chart showing the background data input operation tobe carried out in parallel with a multibank erase.

FIG. 37 is an explanatory diagram illustrating the multibank erase inFIG. 36 and the data input operation of the buffer memory in thebackground data input operation to be carried out thereafter.

FIG. 38 is an explanatory diagram showing the state of an erase block ineach of memory banks BNK0 to BNK3 by the multibank erase in FIG. 37.

FIG. 39 is an explanatory diagram illustrating the summary of thebackground data input operation in the write operation.

FIG. 40 is a timing chart showing the write operation in FIG. 39 and thebackground data input operation.

FIG. 41 is a block diagram showing an example in which a state of writedata transferred from the buffer memory to a sense latch can be detectedon an outside.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 shows the planar layout structure of a flash memory according toan example of a semiconductor storage device according to the invention.A flash memory 1 shown in FIG. 1 is not particularly restricted but isformed on one semiconductor substrate (chip) such as monocrystallinesilicon by a well-known MOS integrated circuit manufacturing method.

The flash memory 1 has four memory banks BNK0 to BNK3 and a control unitCNT, for example. The memory banks BNK0 to BNK3 have flash memory arraysFARY0 to FARY3 to be non-volatile memory units and buffer memories BMRY0to BMRY3 to be buffer units. The buffer memory is arranged with atransverse division into two parts corresponding to one flash memoryarray. For convenience, a suffix (R) is attached to the buffer memory ona right side and a suffix (L) is attached to the buffer memory on a leftside.

External input/output terminals i/o0 to i/o7 of the flash memory 1 arealso used as an address input terminal, a data input terminal, a dataoutput terminal and a command input terminal. The flash memory 1 inputsa command latch enable signal CLE, an address latch enable signal ALE, achip enable signal CEb, a read enable signal REb and a write enablesignal WEb as external control signals, for example, strobe signals andoutputs a ready/busy signal R/Bb. The chip enable signal CEb indicates achip select state for the flash memory 1, the read enable signal REbgives a directive for a read operation from the external input/outputterminals i/o0 to i/o7, and the write enable signal WEb gives adirective for a write operation from the external input/output terminalsi/o0 to i/o7. The command latch enable signal CLE implies that a commandis supplied from an outside to the external input/output terminals i/o0to i/o7 and the address latch enable signal ALE implies that an addresssignal is supplied from the outside to the external input/outputterminals i/o0 to i/o7. The ready/busy signal R/Bb indicates, with a Lowlevel (L), that an erase, write or read operation is being carried outfor any of the flash memory arrays FARY0 to FARY3 (a busy state). It ispossible to recognize a busy state or a ready state for each of theflash memory arrays (FARY0 to FARY3) from the outside by reading statusinformation which will be described below.

The control unit CNT controls a signal interface function with theoutside corresponding to the state of the strobe signal, andfurthermore, controls an internal operation in accordance with an inputcommand.

The respective flash memory arrays FARY0 to FARY3 have a large number ofnon-volatile memory cells arranged in a matrix. While the non-volatilememory cells are not particularly restricted, one memory cell isconstituted by one well-known floating gate type transistor. Forexample, the non-volatile memory cell is constituted by a source and adrain which are formed in a well region, a floating gate formed througha tunnel oxide film in a channel region between the source and thedrain, and a control gate superposed on the floating gate through aninterlayer dielectric film. The control gate is connected to a wordline, the drain is connected to a bit line and the source is connectedto a source line. In FIG. 1, one non-volatile memory cell MC and one bitline G-BL are typically shown, and a sense latch SL constituted by astatic latch circuit is connected to one of the ends of the bit lineG-BL.

In the flash memory 1 of FIG. 1, 512 bytes of storage information arereferred to as one sector. Write and read information storage units are2048 bytes (=4 sectors) and are referred to as one page. 1024 bytes arealso indicated as 1 kilobyte. One page is specified by a page address.Since the flash memory has a field element isolation, an eraseinformation storage unit is set to be a double of the write unit (=4096bytes) which is referred to as one block. The specification of aneven-numbered page address in an erase mode is set to be thespecification of a block.

One non-volatile memory cell in the flash memory 1 stores 2-bitinformation, which is not particularly restricted. In each of the flashmemory arrays FARY0 to FARY3, consequently, 2048-byte non-volatilememory cells are connected to one word line, page address informationspecifies 1024 even-numbered or odd-numbered memory cells to beconnected to one corresponding word line, and 1024-byte sense latches SLare arranged in parallel in order to one-to-one correspond to the 1024memory cells specified by the page address information. The page addressinformation specifies a page address in the whole memory bank, the leastsignificant bit specifies an even or odd number of the page address, ahigh order thereof specifies the word line, and the most significant 2bits specify the memory bank. A word line select decoder which is notshown selects the word line, an even/odd bit line selector which is notshown selects a bit line on an even-numbered or odd-numbered page unit,and 1024-byte bit lines selected by the even/odd numbered bit lineselector are connected to 1024-byte sense latches SL. In the erase mode,an even-numbered page address is regarded as a block address (an addresscorresponding to one word line and 2 pages).

The storage data of the non-volatile memory cell utilize that thethreshold voltage of the memory cell is changed corresponding to anamount of electric charges stored in the floating gate. At this time,the threshold voltage of the memory cell is limited to a desirable rangecorresponding to the value of the storage data and a threshold voltagedistribution thereof is referred to as a memory threshold distribution.For instance, one non-volatile memory cell stores 2-bit information inthis example and four kinds of memory threshold voltage distributionscorresponding to “01, 00, 10, 11” data of the storage information aredetermined. More specifically, the information storage state of onememory cell is selected from an erase state (“11”) to be a fourththreshold voltage (Vth4), a first write state (“10”) to be a firstthreshold voltage (Vth1), a second write state (“00”) to be a secondthreshold voltage (Vth2), and a third write state (“01”) to be a thirdthreshold voltage (Vth3). The threshold voltage has a relationship ofVth4<Vth1<Vth2<Vth3, which is not particularly limited. Four informationstorage states in total are determined by 2-bit data. In order to obtainthe memory threshold distribution, a write verify voltage to be appliedto the word line during a write operation after the erase is set to bethree kinds of voltages which are different from each other, and thesethree kinds of voltages are sequentially changed over to carry out thewrite operation in a division to three times. In each of the three writeoperations, 0V is applied to a write select bit line and 1V is appliedto a non-select bit line. For example, the word line is set to be 17V,which is not particularly restricted. When the time required forapplying a high write voltage is prolonged, the threshold voltage of thememory cell is raised. Three kinds of write threshold voltages can becontrolled by the control of a time in such a high voltage state, andfurthermore, the level control of a high voltage to be applied to theword line. Whether 0V or 1V is applied to the bit line is determined bythe logical value of write control information to be latched to thesense latch circuit SL. For example, the latch data of the sense latchcircuit SL are controlled to be write non-select with a logical value of“1” and write select with a logical value of “0”. Whether “1” or “0” isset to the sense latch SL during the write operation is determined inaccordance with write data on the buffer memory by the control unit CNTcorresponding to the write threshold voltage state in which the write isto be carried out. In a block batch erase, a select word line is set to−16V, a non-select word line is set to 0V, and a select bit line is setto 2V. Referring to the read of the storage information, three kinds ofvoltages to be a word line select level to be applied to the word lineare set, a read operation is carried out three times at a maximum whilethe three kinds of word line select levels are sequentially changed, and2-bit storage information is decided based on a binary (1-bit) valueread from the memory cell in each read operation.

The control unit CNT controls the erase, write and read for the flashmemory arrays FARY0 to FARY3.

The buffer memories BMRY0 to BMRY3 are constituted by an SRAM (StaticRandom Access Memory), for example, and write data input in a binaryfrom the outside to the external input/output terminals i/o0 to i/o7 andread data in a binary output from the external input/output terminalsi/o0 to i/o7 are stored temporarily. The buffer memories BMRY0 to BMRY3are divided into two parts for each memory bank and the buffer memoriesBMRY0 to BMRY3 for each memory bank have minimum storage capacitieswhich are equal to the write unit and the read unit in the respectivecorresponding flash memory arrays. For example, in case of the flashmemory 1, the write information unit and the read information unit areone page (=2 Kbytes). For this reason, the respective buffer memoriesBMRY0 to BMRY3 to be on-chip buffers have a 2-Kbyte storage capacity. Asdescribed above, a set of buffer memories BMRY0 to BMRY3 is arranged ineach memory bank, and the buffer memory provided in the same memory bankis utilized preferentially corresponding to the same flash memory array.In some cases, a buffer memory which is not caused to preferentiallycorrespond is utilized depending on an operation mode. The control iscarried out by the control unit CNT in accordance with a command and anaddress signal.

A data input/output between the flash memory array and the buffer memoryis carried out on an 8-bit unit. In the flash memory arrays FARY0 toFARY3, a sense latch selecting circuit which is not shown selects thesense latch SL on the 8-bit unit. The buffer memories BMRY0 to BMRY3 canbe accessed on the 8-bit unit. A data transfer between the flash memoryarrays FARY0 to FARY3 and the buffer memories BMRY0 to BMRY3 and anaccess control for the buffer memories BMRY0 to BMRY3 are carried out bythe control unit CNT based on a command and access address informationwhich are given from the outside.

FIG. 2 illustrates the details of transmitting paths for an address,data and a command code in the flash memory 1. The command codessupplied to the external input/output terminals i/o0 to i/o7 are inputto the control unit CNT.

External address information given to the external input/outputterminals i/o0 to i/o7 are supplied to an address buffer (ABUF) 10. Theaddress information input to the address buffer 10 include page addressinformation for specifying the page address of the flash memory array inall the memory banks BNK0 to BNK3 and access head address information(buffer head column address information) of the buffer memory, and theaddress information are latched to an address latch circuit which is notshown. The address buffer has a flash address counter (FAC) 11 and abuffer address counter (BAC) 12. The address counter 11 is an addresscounter for generating an address signal to sequentially select a senselatch corresponding to one page on a byte unit. The buffer addresscounter 12 is an address counter for presetting buffer head columnaddress information (which will also be referred to as a column address)and for sequentially generating the access address signal of a buffermemory on an 8-bit unit by setting a preset value or a counter resetvalue as an initial value. The page address information and the outputof the flash address counter 11 are supplied to the flash memory arraysFARY0 to FARY3. The output of the buffer address counter 12 is suppliedto address buffers (buffer unit address buffer=BABUF) 13 a to 13 d ofthe buffer memories BMRY0 to BMRY3. The same output is supplied to thebuffer memories BMRY0 to BMRY3 therefrom.

Write data given to the external input/output terminals i/o0 to i/o7 aresent to one buffer memory BMRYi (i=0 to 3) in the buffer memories BMRY0to BMRY3. The data read from the buffer memory BMRYi are output from theexternal input/output terminals i/o0 to i/o7 to the outside through databuffers (buffer unit data buffer=BDBUF) 14 a to 14 d of thecorresponding buffer memory BMRYi, a data multiplexer (MPX) 15, and adata buffer (DBUF) 16.

Data are input/output on the 8-bit unit between the buffer memoriesBMRY0 to BMRY3 and the flash memory arrays FARY0 to FARY3.

FIG. 3 illustrates a data transfer configuration between the externalinput/output terminals i/o0 to i/o7 and the buffer memory BMRYi (i=0 to3). In a read operation for the flash memory 1, the buffer memory BMRYifor temporarily holding the storage information of the flash memoryarray FARYi selected based on page address information is interfacedwith the external input/output terminals i/o0 to i/o7, and particularly,a buffer memory BMRYi(L) on a left side in one buffer memory BMRYiselected based on the page address information is interfaced with theexternal input/output terminals i/o0 to i/o3 and a buffer memoryBMRYi(R) on a right side in one buffer memory BMRYi selected based onthe page address information is interfaced with the externalinput/output terminals i/o4 to i/o7 so that the storage information areread to the outside. In a write operation for the flash memory 1,moreover, write data to be given to the external input/output terminalsi/o0 to i/o3 are temporarily held in the buffer memory BMRYi(L) on theleft side in one buffer memory BMRYi selected based on the page addressinformation, and write data to be given to the external input/outputterminals i/o4 to i/o7 are temporarily held in the buffer memoryBMRYi(R) on the right side in one buffer memory BMRYi selected based onthe page address information.

FIG. 4 illustrates a data transfer configuration between the buffermemory BMRYi and the flash FARYi. In an access operation for the flashmemory 1, write information to be held temporarily in the buffer memoryBMRYi specified based on the page address information is written to theflash memory array FARYi specified based on the page address informationin a write operation for specifying a memory bank BNKi. In an accessoperation for the flash memory 1, moreover, storage information sentfrom the flash memory array FARYi specified based on the page addressinformation is temporarily held in the buffer memory BMRYi specifiedbased on the page address information in a read operation for specifyingthe memory bank BNKi.

FIG. 5 illustrates the type of an access processing in the flash memory1. FARY is generally referred to as the flash memory arrays FARY0 toFARY3. BMRY is generally referred to as the buffer memories BMRY0 toBMRY3. MCNT represents a flash memory controller to be provided on theoutside of the flash memory 1. The control unit CNT can separatelycontrol a first access processing between the outside and the buffermemory BMRY and a second access processing between the flash memoryarray FARY and the buffer memory BMRY upon receipt of directives fromthe outside, respectively. The first access processing is roughlydivided into a buffer program processing BPGM for writing data from theoutside to the buffer memory BMRY and a buffer read processing BRD forreading data from the buffer memory BMRY to the outside. The secondaccess processing is roughly divided into a flash program processingFPGM for writing the storage information of the buffer memory BMRY tothe predetermined area of the flash memory array FARY, a flash eraseprocessing FERS for erasing the predetermined area of the flash memoryarray FARY, and a flash read processing FRD for reading the storageinformation of the predetermined area of the flash memory array FARY andcausing the buffer memory BMRY to hold the same storage information. Inaddition, for a third access processing, the control unit CNT controls adirect flash access processing DFA for directly reading the storageinformation of the predetermined area of the flash memory array asbinary information to the outside. “Direct” implies that a conversionprocessing between a binary and a 4-value for the storage information isnot carried out.

FIG. 6 schematically illustrates the directive configurations of thefirst access processing and the second access processing.

In FIG. 6, 20 generally denotes an address command, Com1 generallydenotes a first command code such as an address command code, CArepresents the buffer head column address information, and PA representspage address information. 21 generally denotes an access command forgiving a directive for the flash read processing as the second accessprocessing. Com2 represents a second command code constituting an accesscommand. In a column A of FIG. 6, 22 denotes the directive of the bufferread processing BRD as the first access processing. The directive of thebuffer read processing BRD is given in a read enable state (REb=L) in acommand latch disable (CLE=L) and address latch disable (ALE=L) status,for example. A state in which the storage information to be an object ofthe flash read processing FRD indicated by the access command 21 isspecified by the page address information and is completely transferredfrom the flash memory array FARYi to the buffer memory BMRYi isindicated in a ready state (R/Bb=L) to be a first state of theready/busy signal R/Bb to the outside of the flash memory 1. A directive22 of the buffer read processing BRD is given from the outside afterwaiting for the ready state of the ready/busy signal R/Bb. When thedirective 22 of the buffer read processing BRD is given, the dataspecified based on the buffer head column address information are outputfrom the buffer memory BMRYi to the outside synchronously with a changein the clock of the read enable signal REb. The output data are shown asDout.

In a column B of FIG. 6, 23 denotes the directive of the buffer programprocessing BPGM as the first access processing. The directive 23 of thebuffer program processing BPGM is given in a write enable state (WEb=L)in a command latch disable (CLE=L) and address latch disable (ALE=L)status, for example. When the directive 23 of the buffer storeprocessing BPGM is given, input data Din are sequentially storedsynchronously with a change in the clock of the write enable signal WEbby setting, as a head address, the buffer head column addressinformation in the buffer memory BMRYi of the memory bank BNKi specifiedby the page address information. 24 generally denotes an access commandfor giving the directive of the flash program processing FPGM as thesecond access processing. When the directive of the flash programprocessing FPGM is given, the storage information of the buffer memoryBMRYi is written to the page address of the flash memory array FARYispecified by the page address information. The ready/busy signal R/Bb isbrought into a busy state until the write operation is completed.

In a column C of FIG. 6, the access command 21 for giving the directiveof the flash read processing FRD to be the second access processing inthe column A of FIG. 6 is omitted and the directive of the buffer readprocessing BRD to be the first access processing is given immediatelyafter the address command 20 (22). In the directive configuration of theaccess processing, data Dout are sequentially output synchronously witha change in the clock of the read enable signal REb by setting thebuffer head column address information to be a head address from thebuffer memory BMRYi in the memory bank BNKi determined in accordancewith the page address information of the address command 20. At thistime, the directive of the second access processing 21 is not given. Forthis reason, an access to the flash memory array FARYi is not carriedout. In the case in which the data held in the buffer memory BMRYi areto be read out, there is not brought the busy state until the datatransfer from the flash memory array FARYi to the buffer memory BMRYi iscompleted as in the column A. Consequently, the external outputoperation timing of data to be read is quickened.

In a column D of FIG. 6, the directive 23 of the buffer store processingBPGM to be the first access processing in the column B of FIG. 6 isomitted and the directive 24 of the flash program processing FPGM to bethe second access processing is given immediately after the addresscommand. In the directive configuration of the access processing, thestorage information of the buffer memory BMRYi in the memory bank BNKidetermined in accordance with the page address information of theaddress command 20 is written to the page of the flash memory arrayFARYi specified by the page address information. At this time, thedirective of the first access processing 23 is not given. For thisreason, it is not necessary to receive the supply of the write data fromthe outside to the buffer memory BMRYi. In the case in which the dataheld in the buffer memory BMRYi are to be written to the flash memoryarray FARYi, it is not necessary to receive the transfer of the writedata from the outside as in the column B. Therefore, it is possible toshorten a period required for completing the write to the flash memoryarray FARYi.

FIG. 7 shows a specific example of a command architecture in the flashmemory 1. An address command code is illustrated in a column of Com 1and an access command code is illustrated in a column of Com2. In theflash memory 1, clear for the buffer memory BMRYi is carried outexpressly. In order to execute the processings described in the C and Dcolumns of FIG. 6, significant data are to remain in the buffer memoryBMRYi. The reason is that the foregoing is to be guaranteed. Forexample, a buffer clear command of No. 22 is executed to clear thestorage information in all the buffer memories BMRY0 to BMRY3. A commandcode “FEH” of Com1 in the buffer clear command gives the directive of abuffer clear operation. FIG. 8 typically shows the contents of a clearprocessing in accordance with the buffer clear command.

When the Com1 is accompanied by an address command code “80H” in FIG. 7,the clear processing is previously carried out for the buffer memorydetermined based on page address information PA and a data transferprocessing is then started. When the address command having 80H as ahead is continuously given, the clear processing is carried out for onlya first time. When the Com1 is accompanied by an address command code“00H”, the clear processing is not carried out.

In FIG. 7, a command code of basic write for the flash memory array isset to be “10H” and “16H” and a command code for basic read for theflash memory array is set to be “30H”. The write or read based on thecommand codes is optional within a range of 1 to 4 pages. For the pageaddress information required for the write or read of a plurality ofpages, it is preferable that the address commands setting “00H” and“80H” to be heads should be repeated at plural times. It is preferablethat the necessary write data for writing a plurality of pages should beinput in accordance with the directive of the first access processingevery time the page address information is input, for example. While theexternal read of the storage information transferred from the flashmemory array FARYi to the buffer memory BMRYi is preferably carried outin accordance with the directive of the first access processing, it isalso possible to perform the external read of the data with the optionalcolumn address of the buffer memory to be a starting point by utilizingrandom access commands illustrated in command Nos. 2 and 3 in FIG. 7when the storage information of the pages are to be sequentially readfrom the buffer memories BMRYi. The optional column address to be thestarting point is specified by the CA and the buffer head column addressinformation thus specified are preset to the buffer address counter 12in FIG. 2 and are sequentially updated. FIG. 9 typically shows thecontents of the write or read processing for any of the 1 to 4 pages.

In the write or read processing, the buffer memory is caused topreferentially correspond to the flash memory array of the same bank.More specifically, when the memory bank BNKi is specified with the pageaddress information in a preferential correspondence relationship, thespecification is regarded as the specification of the flash memory arrayFARYi and the buffer memory BMRYi in the same bank. The presence of thepreferential correspondence relationship is not particularly restrictedbut is determined with the command code of the access command. In FIG.7, a non-preferential correspondence relationship is selected in case ofaccess command codes “31H”, “12H” and “17H” of the Com 2 and thepreferential correspondence relationship is selected in the other cases.Referring to the non-preferential correspondence relationship,similarly, a correspondence relationship between the flash memory arraysFARY0 to FARY3 and the buffer memories BMRY0 to BMRY3 is predetermined.More specifically, the flash memory arrays FARY0, FARY1, FARY2 and FARY3are caused to non-preferentially correspond to the buffer memoriesBMRY2, BMRY3, BMRY0 and BMRY1. FIG. 10 illustrates the preferential andnon-preferential correspondence relationships of the buffer memory withthe flash memory array.

The connection of the buffer memory having the preferentialcorrespondence relationship with the flash memory array and theconnection of the buffer memory having the non-preferentialcorrespondence relationship with the flash memory array can be selectedby a change-over switch for exclusively changing over the mutualconnections, which is not particularly shown.

In the write or read operation for the flash memory array, particularly,a dedicated access command is prepared for the operation of a 4-pagespecification. An access command code for a 4-page write is “13H” and“18H” and an access command code for a 4-page read is “30H”. FIG. 11typically shows the contents of the 4-page write or read processing.

In FIG. 7, the basic command code of an erase for the flash memory arrayis set to be “D0H”. The directive of a parallel erase can be given up to8 pages at a maximum on a 2-page unit. The erase based on the commandcode is set to be optional within a range of 2 to 8 pages. For thenecessary page address information for the erase of a plurality ofpages, it is preferable that an address command having “60H” to be ahead should be repeated at plural times. FIG. 12 typically shows thecontents of an erase processing for any of the 2 to 8 pages.

In the erase operation for the flash memory array, particularly, adedicated access command is prepared for an 8-page specifying operation.The access command code of the 8-page erase is “D1H”. FIG. 13 typicallyshows the contents of the 8-page erase processing.

In FIG. 7, a command No. 20 is a direct flash access command (a binaryread command) and 2-bit storage information which is stored in onememory cell is read as 1-bit storage information. FIG. 14 typicallyshows the contents of a direct flash access processing.

The flash memory 1 has status information for each flash memory arrayFARYi in a status register and the status information can be read to theoutside based on a command code 7*H (70H to 76H) of the Com 1 in FIG. 7.In brief, it is possible to grasp a ready state and a busy state foreach flash memory array FARYi, and furthermore, a state of writepass/fail on an outside. In the flash memory 1, consequently, it ispossible to easily give the directive of an access processing for thememory bank which is not operated or the directive of the firstprocessing for the memory bank BNKi during an erase operation.

FIG. 15 is a state transition diagram illustrating a control respondingto the address command and the directives of the first and second accessprocessings. The state transition control is set to be the controlcontents of the control unit CNT. A control state shown in hatching inFIG. 15 is brought into a busy state.

Description will be given to a read operation control (4 Page Read[30H]). The address of a read page is specified by using an addresscommand (addressing command) code “00H”. An address is specified inorder of CA and PA. By using a flash system read command 30H (31H, 3AH),next, the data of a memory cell specified in accordance with the addresscommand are transferred to the buffer memory BMRYi to be an on-chipbuffer corresponding to a selected page. A status during a transfer isset to be busy. After the execution of the flash system read command iscompleted, the storage information of the buffer memory BMRYi is outputto the outside synchronously with a change in the read enable signalREb. In the case in which a plurality of pages is intended for the read,it is preferable to repeat the address command “00H”. After an operation(Flash→Buffer) for reading the storage information from the flash memoryarray to the buffer memory BMRYi is completed, the storage informationof the buffer memory BMRYi is output from the head to the outsidesynchronously when the clock of the read enable signal REb is changed.When the command code of No. 2 or No. 3 in FIG. 7 is put in before thechange in the clock of the read enable signal REb, data having, as ahead, a column address specified by the CA can be output.

Description will be given to a write operation control (Page Program[10H]). The address of a page to be written is specified by using anaddressing command “80H” or “00H”. The address is input in order of CAand PA. Then, write data are input from the outside to the buffer memoryBMRYi corresponding to a selected page synchronously with a change inthe clock of the write enable signal WEb. When the input of the writedata from the outside is completed, the write data on the buffer memoryBMRYi are transferred to the page specified in accordance with theaddress command by using a flash system write command 10H or 12H. Astatus during the transfer is set to be busy. After the write is ended,a status code can be confirmed by using a command such as 70H.

Description will be given to a rewrite operation control (Read-ProgramBack [35H-15H(10H)]). The data on a page address are read from the flashmemory array FARYi to the buffer memory BMRYi in accordance with theaddress command “00H” and an access command “35H”, and the columnaddress of data to be rewritten on the buffer memory BMRYi is thenspecified in accordance with the buffer head column address informationof the CA incidental to an address command “85H” and data on the columnaddress thus specified are input to the buffer memory BMRYi. Thereafter,the data of the buffer memory BMRYi are written back to the page addressof the flash memory array FARYi in accordance with an access command“15H”. Consequently, it is possible to carry out a rewrite to theoptional region of the flash memory array FARYi.

Description will be given to an erase operation control (Block Erase[D0H], 4 Block Erase [D1H]). The address of a block to be erased isspecified by using an addressing command 60H. In the case in which aplurality of blocks is to be erased, the processing is repeated. Theaddress specifies the PA and is converted to a block address in a chip.By using a flash system erase command D0H or D1H, next, the blockspecified in accordance with the address command is erased. A statusduring the erase is set to be busy. After the erase is ended, a statuscode is confirmed by using a command such as 70H. Moreover, data can beinput/output between the buffer memory which is not utilized and theoutside simultaneously with the execution of the flash system erasecommand such as D0H (a background data access).

Description will be given to a binary read operation (a direct flashaccess) (Direct Flash Access [3AH]). In the case in which an accesscommand code “3AH” of the buffer memory is specified, 2-bit storageinformation stored in one memory cell is read as 1-bit storageinformation. More specifically, the storage of information in the memorycell intended for the direct flash access is selected from two statesincluding an erase state and a third write state having the highestthreshold voltage in consideration of a read operation margin taken tobe great. In the read operation, the threshold voltage between the erasestate and the third write state is set to be a read word line voltage,and storage information thus read is exactly used as read data forbinary storage information.

Description will be given to a clear command (Buffer Clear). In a clearcommand code “FEH”, all the buffer memories BMRY0 to BMRY3 are clearedin a batch. Herein, “clear” implies that all storage information are setto have a logical value of “0”, which is not particularly restricted. Inthe flash memory arrays FARY0 to FARY3, write data having the logicalvalue of “0” are assumed to have a logical value for a write inhibition.By preparing the clear commands of the buffer memories BMRY0 to BMRY3,it is possible to carry out a write with random data input in a page (anadditional write) at a high speed. In the case in which the additionalwrite is to be carried out, it is necessary to input dummy data (apattern having the logical value of “0”) which implies a writeinhibition to a region in which the write is not carried out if thereare no clear commands of the buffer memories BMRY0 to BMRY3. Then, it isnecessary to change the clock of the write enable signal WEb on thewrite unit. On the other hand, if there are the clear commands of thebuffer memories BMRY0 to BMRY3, the dummy data representing the writeinhibition are set onto the buffer memories BMRY0 to BMRY3 when thebuffer memories BMRY0 to BMRY3 are cleared. Therefore, the write enablesignal WEb may be clocked corresponding to a data size on the writeunit.

Next, the access operation of the flash memory 1 will be generallydescribed.

FIG. 16 shows a rewrite operation for the flash memory. A data flow isshown on a right side and an operation procedure is shown on a leftside. Herein, a rewrite on an erase unit (2 pages=4 Kbytes) is supposedand two buffer memories BMRY corresponding to the erase unit will bereferred to as an on-chip buffer (4K). In a processing [1], memory celldata are transferred to the on-chip buffer (4K) in accordance with aread command (flash system). In a processing [2], a memory cell iserased in accordance with an erase command (flash system). In aprocessing [3], write data are overwritten to the on-chip buffer (4K)simultaneously with the operation in the processing [2] (buffer system).In a processing [4], after the processings [2] and [3] are ended, thedata of the on-chip buffer are subsequently transferred to the memorycell in accordance with a write command (flash system).

The on-chip buffer (4K) corresponds to two buffer memories BMRYi andBMRYj in the buffer memories BMRY0 to BMRY3 in FIG. 1. In FIG. 17, thisrespect is made clear and are write operation for the flash memory isshown.

In FIG. 17, the memory cell data (=4 Kbytes) are transferred to theon-chip buffers BMRYi and BMRYj in accordance with a read command (flashsystem) in a processing [1]. At this time, the data are also saved inthe buffer memory (=2 Kbytes) BMRYj of a non-select memory bank togetherwith the corresponding buffer memory (=2 Kbytes) BMRYi of a selectmemory bank. In a processing [2], the memory cell is erased inaccordance with an erase command (flash system). In a processing [3],write data are overwritten to the on-chip buffer memories BMRYi andBMRYj simultaneously with the operation in the processing [2] (buffersystem). In a processing [4], after the processings [2] and [3] areended, the data of the on-chip buffer memories BMRYi and BMRYj aresubsequently transferred to the memory cell in accordance with a writecommand (flash system).

FIG. 18 shows another rewrite operation for the flash memory. A dataflow is shown on a right side and an operation procedure is shown on aleft side. Herein, a rewrite on an erase unit (2 pages=4 Kbytes) issupposed and the buffer memory BMRY corresponding to the erase unit willbe referred to as an on-chip buffer (4K). Herein, the data are rewrittenat necessary number of times over the buffer memory and a write to theflash memory array is thus carried out (=Read-Program Back mode). Morespecifically, in a processing [1], memory cell data are transferred tothe on-chip buffer BMRY in accordance with a read command (flashsystem). In a processing [2], a memory cell is erased in accordance withan erase command (flash system). In a processing [3], write data areoverwritten to the on-chip buffer BMRY simultaneously with the operationin the processing [2] (buffer system). In a processing [4′], the writedata thus changed are overwritten to the on-chip buffer memory BMRYagain. The buffer system command is executed at a speed which is almostten times as high as the speed of the flash system command. For thisreason, an operation for simply executing the buffer system commandpositively utilizes only the buffer system command. It is also possibleto carry out the write in the processing [4] at any time which isrequired. In a processing [5], the power supply of a chip is turned offor the data of the on-chip buffer BMRY are transferred to the memorycell in accordance with a write command (flash system) before a nextaddressing command is input. There is no frequency limit for the changeof the buffer data (=buffer data write) to be carried out during theoperations [1] to [5]. It is possible to execute the change of thebuffer data if necessary.

FIG. 19 shows a cache read operation for the flash memory. A data flowis shown on a right side and an operation procedure is shown on a leftside. Herein, a read is carried out on a page unit (=2 Kbytes) and theon-chip buffer to be the buffer memory BMRYi receives the read data on apage unit. In a processing [1], the memory cell data are transferred tothe on-chip buffer BMRYi in accordance with a read command (flashsystem). In a processing [2], subsequently, the data of the on-chipbuffer are read from i/o to the outside synchronously with a change inthe clock of the read enable signal REb. In a processing [3], in thecase in which the same page is to be continuously read out, data on theon-chip buffer BMRYi are exactly output from the i/o to the outsidesynchronously with the change in the clock of the read enable signal REbwithout using the flash system read command. This processing can beexecuted many times until the data on the on-chip buffer BMRYi arerewritten. At this time, when whether a page address specified inaccordance with an address command is coincident (page address hit) ornon-coincident (page address miss hit) with the page address of the dataon the on-chip buffer BMRYi is decided at a flash memory controller MCNTside on the outside of the flash memory, it is unnecessary to carry outstatus polling for obtaining the result of the decision. In brief, amemory controller itself to be an access request source recognizes thestate of the page address hit or the page address miss hit, therebygiving an access request. For this reason, it is not necessary to waitfor the memory controller to recognize, through the polling, a state inwhich the data output timing of the flash memory is varied depending onthe page address hit or the page address miss hit.

FIG. 20 shows an example of the case in which the decision of the pageaddress hit and the page address miss hit for the cache read operationin the flash memory is carried out by the flash memory. A hardwarestructure for the decision is illustrated on a right side and a controlprocedure thereof is illustrated on a left side.

Address latch circuits 30 and 31 for holding respective page addressinformation in an access to be carried out twice before and after areprepared for the address buffer (ABUF) 10 in FIG. 2. The first addresslatch circuit 30 stores page address information which is beingoperated, and the second address latch circuit 31 stores page addressinformation about the last operated access. In a processing [1], when acommand (flash system) for reading the memory cell data is input, thevalue of the first address latch circuit 30 and that of the secondaddress latch circuit 31 are compared with each other by a comparingcircuit 32. The result of the comparison is given to the control unitCNT. The control circuit CNT returns the ready/busy signal R/Bb (orstatus) into the ready state without carrying out the data readoperation for the flash memory array FARYi when the values of theaddress latch circuits 30 and 31 are coincident with each other (aprocessing [3]) so that the data of the buffer memory BMRYi can beoutput. Subsequently, the value of the first address latch circuit 30 iscopied onto the second address latch circuit 31.

In the case in which the values of the address latch circuits 30 and 31are not coincident with each other, the memory cell data of the flashmemory array FARYi are transferred to the on-chip buffer BMRYi (aprocessing [2]). During the transfer, the busy state is set.Subsequently, the value of the first address latch circuit 30 is copiedonto the second address latch circuit 31.

During the comparing and deciding operation, an external flash memorycontroller FCNT carries out the status polling. When the ready state isconfirmed in response to the ready/busy signal R/Bb, the clock of theread enable signal REb is changed to output data from the on-chip buffermemory BMRYi to the i/o.

FIG. 21 illustrates a copy write operation. A data flow is shown on aright side and an operation procedure is shown on a left side. Herein, awrite is carried out on a page unit (=2 Kbytes) and the on-chip bufferto be the buffer memory BMRYi gives write data to the flash memory arrayFARYi on the page unit. An operation shown in FIG. 21 is used for awrite error processing or data write multiplexing. In a processing [1],write data are written to the on-chip buffer BMRYi (buffer systemcommand). In a processing [2], subsequently, the data of the on-chipbuffer BMRYi are transferred to the flash memory array FARYi inaccordance with a write command (a flash system command). In aprocessing [3], in the case in which the same data are to be written toa different page from the page selected in the processing [2] (in brief,a copy is to be carried out), the page address of a copy destination isspecified in accordance with an addressing command and the data of theon-chip buffer BMRYi are transferred to the memory cell in accordancewith a write command (flash system) again. This processing can beexecuted many times until the data on the on-chip buffer BMRYi arerewritten.

Next, the access operation timing of the flash memory 1 will begenerally described.

FIG. 22 illustrates a read operation timing. This corresponds to thecase of the command configuration in the column A of FIG. 6, andfurthermore, corresponds to a read operation through the processings [1]and [2] of FIG. 19. In FIG. 22, Col.Add1 and Col.Add2 correspond to CAand Raw.Add1 and Raw.Add2 correspond to PA. A time T1 in FIG. 22 isequivalent to an operation time from the read of data from the flashmemory array FARYi to a transmission to the buffer memory BMRYi.

FIG. 23 illustrates a cache read operation timing. This corresponds tothe case of the command configuration in the column C of FIG. 6, andfurthermore, corresponds to the read operation in the processing [3] ofFIG. 19. After the address command is input, it is not necessary to waitfor the operation of the flash memory array FARYi. Therefore, the R/Bbis not brought into the busy state but data can be immediately output tothe outside.

FIG. 24 illustrates a write operation timing. This corresponds to thecase of the command configuration in the column B of FIG. 6, andfurthermore, corresponds to a write operation through the processings[1] and [2] of FIG. 21. In FIG. 24, Col.Add1 and Col.Add2 correspond tothe CA and Raw.Add1 and Raw.Add2 correspond to the PA. A time T2 in FIG.24 is equivalent to an operation time required for writing the data heldin the buffer memory BMRYi to the flash memory array FARYi.

FIG. 25 illustrates a copy write operation timing. This corresponds tothe case of the command configuration in the column D of FIG. 6, andfurthermore, corresponds to the write operation in the processing [3] ofFIG. 21. After the address command is input, it is not necessary to waitfor the write data to be transferred from the outside to the buffermemory BMRYi. Consequently, it is possible to shorten a time requiredfor the whole write operation.

FIG. 26 is a timing chart showing the case in which a page addresscomparison for the cache read operation is carried out by the flashmemory controller MCNT, and this corresponds to the operation in theprocessing of FIG. 19. In FIG. 26, CA1 and CA2 correspond to the CA.When continuously carrying out a flash read access, the flash memorycontroller MCNT compares a page address to be read accessed with a pageaddress which has been read accessed immediately before (S1 a) and thenoutputs an address command (S2 a). In the case in which the results ofthe S1 comparison are not coincident with each other, the flash memorycontroller MCNT then outputs an access command (for example, “30H”) forthe flash read access and waits for a change to the ready state throughthe status polling in response to the ready/busy signal R/Bb (S3 a).During that time, the flash memory controller MCNT reads storageinformation from the specified page address and transfers the read datato the corresponding buffer memory BMRYi. When detecting the readystate, the flash memory controller MCNT outputs the read data from thebuffer memory BMRYi to the outside synchronously with a change in theclock of the read enable signal REb (S4 a). In the case in which theresults of the S1 a comparison are coincident with each other, theprocessing S3 a is omitted and the flash memory controller MCNTimmediately outputs the read data from the buffer memory BMRYi to theoutside synchronously with the change in the clock of the read enablesignal REb (S4 a). The reason is that the storage information of a pageaddress intended for an access has already been held in thecorresponding buffer memory BMRYi in the flash read access processingimmediately before. A command for carrying out the cache read processingmay be the access commands of No. 2 and No. 3 in FIG. 7.

FIG. 27 is a timing chart showing the case in which the page addresscomparison for the cache read operation is carried out by the flashmemory, and this corresponds to the operation in the processing of FIG.20. In FIG. 27, CA1 and CA2 correspond to the CA. When carrying out theflash read access, the flash memory controller MCNT immediately outputsan address command without performing the address comparison (S1 b).Then, the flash memory controller MCNT outputs an access command (forexample, “30H”) for the flash read access and waits for a change to theready state through the status polling in response to the ready/busysignal R/Bb (S2 b). During that time, the flash memory compares a pageaddress intended for the read access which is specified with a pageaddress which has been subjected to the read access immediately before.In the case in which the results of the comparison are not coincidentwith each other, the flash memory reads storage information from thespecified page address and transfers the read data to the correspondingbuffer memory BMRYi, and then gives a notice of the ready state throughthe ready/busy signal R/Bb. In the case in which the results of thecomparison are coincident with each other, the flash memory immediatelygives the notice of the ready state through the ready/busy signal R/Bb.More specifically, a period for the status polling is shortened by atime IT through the coincidence of the results of the comparison. Whendetecting the ready state, the flash memory controller MCNT outputs, tothe outside, data retained in the buffer memory BMRYi synchronously witha change in the clock of the read enable signal REb (S3 b). A commandfor carrying out the cache read processing may be the access commands ofNo. 2 and No. 3 in FIG. 7.

FIG. 28 shows the pipeline of a data output system in the flash memory1. On a signal path to be used for the first access processing areprovided an address buffer (ABUF) 10 for latching address informationsent from the outside, a buffer unit address buffer (BABUF) 13 m (m=a tod) for inputting the output of the address buffer 10 and supplying thesame output to the buffer memory BMRYi, a buffer unit data buffer(BDBUF) 14 m for latching data output from the buffer memory BMRYi, anda data buffer (DBUF) 16 for latching the output data of a buffer unitdata buffer 14 m and outputting the same output data to the outside. Thenumber of pipeline stages from the address input to the data output isfour. The address buffer 10 carries out a latch operation synchronouslywith a change in the clock of an enable signal EN, which is notparticularly restricted. The buffer unit address buffer 13 m, the bufferunit data buffer 14 m and the data buffer 16 carry out the latchoperation synchronously with a change in the clock of a clock signalCLK. The control unit CNT generates the enable signal EN and the clocksignal CLK.

FIG. 29 illustrates each output signal waveform in the pipeline of FIG.28. When recognizing the address commands CA1 and CA2 synchronously witha change in the clock of a write enable signal (WEb) in an address latchenable state (ALE=H), the control unit CNT changes the clock of theenable signal EN synchronously with the change in the clock of the writeenable signal (WEb) (Tm1). Moreover, the clock of the clock signal CLKis changed synchronously with a change in the clock of the read enablesignal REb for giving the directive of a data read to the outside in acommand latch disable state (CLE=L) and an address latch disable state(ALE=L) in the first access processing (Tm2).

The change in the clock of the Tm1 controls the initial latch operationof the address buffer 10, thereby deciding internal address informationADD1. The change in the clock of the Tm2 decides the initial data outputof the data buffer 16. At this time, the control unit CNT independentlychanges the clock signal CLK in order to control the initial latchoperations of the buffer unit address buffer 13 m and the buffer unitdata buffer 14 m (Tm3). More specifically, the control unit CNTrecognizes the address commands CA1 and CA2 synchronously with thechange in the clock of the write enable signal (WEb) in the addresslatch enable state (ALE=H), and then generates, as dummy clocks, thelatch timing of the buffer unit address buffer 13 m and that of thebuffer unit data buffer 14 m before the read enable signal REb forgiving the directive of the data read to the outside is changed in thefirst access processing.

In consideration of the case in which an accessing object address basedon an address command is continuously provided in order of A1, A2, A3 .. . so that the read data are continuously present in order of D1, D2,D3 . . . , consequently, the output ADD1 of the address buffer 10 isdecided to be A1 with the change in the clock of the Tm1 in an initialaddress input, an output ADD2 of the buffer unit address buffer 13 m isdecided to be A1 with the change in the clock at the beginning of nextTm3, and furthermore, data data1 read from the buffer memory BMRYi in adecided address a1 is decided to be D1. Output data data2 of the bufferunit data buffer 14 m are decided to be D1 with a next change in theclock of the Tm3. Then, the initial data D1 are output from the databuffer 16 to the outside with the initial change in the clock of theTm2. Succeeding data are sequentially output in a pipeline.

By independently generating the clock, it is possible to take acountermeasure against a pipeline operation in an initial portion evenif the number of the pipeline stages from the address input to the dataoutput is comparatively large.

Next, description will be given to a background data input operation.

FIG. 30 schematically illustrates the background data input operation.The background data input operation is set to be a data input operationfor a high speed write to input data to be written next from theexternal input/output terminals i/o0 to i/o7 to the buffer memory BMRY1and to shorten a write time after an erase while erasing the memory dataof a select address in the flash memory array FARYi.

FIG. 31 is a timing chart illustrating a difference between a writeoperation utilizing the background data input and a write operationutilizing no background data input. The erase of the memory cell and theinput of the write data from the external input/output terminals i/o0 toi/o7 to the buffer memory BMRYi are parallelized. Correspondingly, awrite time to the flash memory array FARYi can be shortened.

FIG. 32 illustrates the more detailed concept of the background datainput. Herein, there is illustrated an operation for inputting writedata to two buffer memories BMRY0 and BMRY2, for example, during a batcherase for the flash memory arrays FARY0 to FARY3 of four memory banksBNK0 to BNK3. First of all, when a multibank erase command is put in, anerase for the select block of each of the flash memory arrays FARY0 toFARY3 is carried out in a foreground. At the same time, in a background,write data are sequentially stored serially on an 8-bit unit in thebuffer memories BMRY0 and BMRY2 specified in accordance with the addresscommand. After the erase is ended, the write data of the buffer memoriesBMRY0 and BMRY2 are written to the select pages of the flash memoryarrays FARY0 and FARY2 in the foreground.

FIG. 33 is a timing chart illustrating erase and write operations towhich the background data input operation is applied. Herein, there isillustrated the case in which data to be written next are subjected tothe background data input while a 4-bank batch block erase is carriedout for four continuous blocks over the memory banks BNK0 to BNK3.

First of all, when a first command code (Com1), for example, an erasecommand (erase 1st Com.) such as 60H, a page address (Page M), and asecond command code (Com2), for example, a continuous 4-block erasestart command (erase 2nd Com.) such as D1H are put in, the continuous4-block erase including select pages over the memory banks BNK0 to BNK3is started. After the erase is started, the read/busy signal R/Bb ischanged into a Low level (L) so that a busy state is set.

During the busy state, a command input is carried out from the outsidein order of a first command code (Com1), for example, an address commandcode such as 80H, a necessary column address (CA1, CA2), a page address(RA1, RA2) and write data (DinN . . . ) in order to give the directiveof a data input to the buffer memory. Consequently, the write data arestored in the buffer memories corresponding to the column address (CA1,CA2) and the page address (RA1, RA2). By repeating the command input atthe necessary number of times, it is possible to carry out thebackground data input operation over a plurality of buffer memories.

After a notice of the end of the erase is given to the outside throughthe ready/busy signal R/Bb, a second command (Com2), for example, awrite command such as 13H (write 2nd Com.) is put in so that a write toa corresponding flash memory array is started from the buffer memory,for example. At this time, the write page is set to be a page specifiedin accordance with the page address (RA1 RA2) following the firstcommand code (Com1), for example, an address command code such as 80H.In the case in which the write page to the flash memory array is to bechanged, it is preferable that the address command code (write 1st Com.)such as 80H, the necessary column address (CA1, CA2) and the pageaddress (RA1, RA2) should be inserted at the necessary number of timesbefore the write command (write 2nd Com.) such as 13H as shown in FIG.33.

FIG. 34 illustrates the data input operation of the buffer memory in thebackground data input operation of FIG. 33. As is apparent from FIG. 34,write data (Data In) are input serially to the memory banks BNK0 to BNK3simultaneously with an erase operation to be carried out after thecontinuous 4-block erase start command (erase 2nd Com.) is put in.

FIG. 35 illustrates the operation states of the buffer memory and theflash memory array in the background data input operation of FIG. 33. Acolumn A in FIG. 35 shows a state in which the continuous 4-block eraseis started for a block including a select page in each memory bank. Acolumn B in FIG. 35 shows a state in which write data to the flashmemory array are subjected to the background data input to the buffermemory during an erase. The order of the operations [2] to [5] may beoptional. A column C in FIG. 35 illustrates a state in which a write isstarted by putting in a write operation start command after the end ofthe erase operation. This example indicates the case in which the writeis carried out at the same page address as an erase select page. A writepage address for the flash memory array can also be optional as shown ina column D of FIG. 35. It is preferable to put in the address commandcode again to carry out addressing before putting in the write operationstart command. As illustrated in a column E of FIG. 35, moreover, it isalso possible to carry out a write operation using a buffer memoryhaving a non-preferential relationship with the flash memory array. Itis preferable that a write start command such as 12H or 17H should beutilized.

FIG. 36 illustrates the background data input operation to be carriedout simultaneously with a multibank erase. The multibank erase impliesan operation for selecting and erasing different pages in each of thebanks. When the specification of the first command code (Com1), forexample, an erase command (erase 1st Com.) such as 60H and a pageaddress is repeated four times and the second command code (Com2), forexample, an erase start command such as D0H is then put in, a batcherase for the page address specified by each of the memory banks BNK0 toBNK3 is started. Simultaneously with the erase operation, the samebackground data input operation as that described in FIG. 33 can becarried out.

FIG. 37 illustrates the multibank erase in FIG. 36 and the data inputoperation of the buffer memory in a subsequent background data inputoperation. In the multibank erase, the erase page address of the memorybank BNK0 is represented as pageL, the erase page address of the memorybank BNK1 is represented as pageM, the erase page address of the memorybank BNK2 is represented as pageN, and the erase page address of thememory bank BNK3 is represented as pageP. As is apparent from FIG. 37,the write data (Data In) are input serially to the memory banks BNK0 toBNK3 simultaneously with the erase operation to be carried out after the4-bank batch block erase start command (erase 2nd Com.) is put in.

FIG. 38 shows an erase block in each of the memory banks BNK0 to BNK3based on the multibank erase in FIG. 37.

FIG. 39 illustrates the summary of the background data input operationfor inputting next write data into the buffer of a write bank whiletransferring the write data in the buffer memory and then writing thedata into the memory array of a select page during the write operation.First of all, the write data are stored from the external datainput/output terminals i/o0 to i/o7 into the buffer memory BMRYi asshown in <A> of FIG. 39. As shown in <B>, next, the write data of thebuffer memory BMRYi are latched into the sense latch SL of thecorresponding flash memory array FARYi. The data latched into the senselatch SL are started to be written to the memory cell as shown in <C>.During the write, next write data are input from the outside to thebuffer memory BMRYi as shown in <D>.

FIG. 40 is a timing chart showing the write operation in FIG. 39 and thebackground data input operation. A command is input from the outside inorder of the first command code (Com1), for example, an address commandcode such as 80H, a necessary column address and page address and writedata (Data In). Consequently, the write data are stored in the buffermemory corresponding to the column address and the page address. Then,the second command (Com2), for example, the write command (write 2ndCom.) such as 10H is put in so that the write from the buffer memory tothe corresponding flash memory array is started, for example. At thistime, the write page is set to be a page specified by a page addressfollowing the first command code (Com1), for example, the addresscommand code such as 80H. In this case, the ready/busy signal R/Bb isfirst set to have a Low level and a notice of a busy state is given tothe outside. First of all, the write data are fetched from the memorybuffer into the sense latch in the flash memory array and a writeoperation to the memory cell is started in accordance with the writedata fetched into the sense latch. When the write data are input fromthe outside in accordance with the flow of the data input shown in thecolumn B of FIG. 6 during the write operation to the memory array (DataIn), next write data are stored in the buffer memory. Thereafter, thesecond command (Com2), for example, the write command (write 2nd Com.)such as 10H is put in as described above so that the write from thebuffer memory to the corresponding flash memory array is started, forexample. In the operations of FIGS. 39 and 40, the write data aretransferred from the buffer memory to the sense latch and the next writedata are then started to be stored in the buffer memory. The timing canbe implemented by waiting for the passage of a predetermined time afterdetecting the change of the ready/busy signal R/Bb into the busy stateby an external memory controller. As illustrated in FIG. 41,alternatively, the control unit CNT asserts a signal BDI upon receipt ofa count-up signal CNTU of the FAC 11 in the ABUF 10. The assert timingof the signal BDI is brought into the busy state and is set to be atiming in which the write data are completely transferred from thebuffer memory to the sense latch. It is preferable that the externalmemory controller should supply the next write data (Data In) to theflash memory in accordance with a data input command after the signalBDI is asserted.

According to the flash memory described above, the following functionsand advantages can be obtained.

[1] The directive or command of the access processing for the flashmemory 1 is divided into two systems having a flash system (a transferbetween a flash memory array and an on-chip buffer memory) and a buffersystem (a transfer between the on-chip buffer memory and i/o). By usingthem in combination or singly, it is possible to give an access to theflash memory 1. By thus dividing the command into the two systems, it ispossible to give an access to the on-chip buffer memory from the outsidein parallel in such an operation mode as not to utilize the on-chipbuffer memory BMRYi as in the erase operation. By positively utilizingthe transfer between the high-speed on-chip buffer memory and the i/o,moreover, it is possible to carry out a cache read. By providing writingserial clock (WEb signal) and reading serial clock (REb signal)terminals and preparing an addressing command (for example, the commandsof No. 2 and No. 3 in FIG. 7) which can specify the value of the addressbuffer from the outside, furthermore, it is possible to input/outputdata between the on-chip buffer memory designated by the address bufferand the i/o synchronously with an external clock even if the commandinput is not present during a standby.

[2] The data on the on-chip buffer memory BMRYi are held until a bufferclear command is input. Therefore, a user can manage the data on theon-chip buffer memory BMRYi.

[3] In the operation mode of the flash system, it is possible to acceptthe command of the buffer system for the on-chip buffer memory BMRYiwhich is not used.

[4] The operation unit of the buffer system command is set to be a pageunit. By using a command specifying the address (=CA) in a pagetogether, however, it is also possible to selectively transfer anoptional region in the page.

[5] The operation unit of the flash system command is also the pageunit. In such an operation, however, the selective transfer of theoptional region in the page between the buffer memories BMRY0 and BMRY3is not implemented. The reason is that a control can be prevented frombeing extremely complicated. In addition, it is supposed to besubstantially sufficient that an optional selection in the page isimplemented in accordance with the buffer system command.

[6] By writing sector management information or ECC data such as storageinformation as binary data to the flash memory array FARYi, it ispossible to directly transfer the storage information from the flashmemory array FARYi to the i/o without carrying out the binary

4-value conversion over the data (a direct flash access mode).Consequently, it is possible to carry out an immediate transition to acontrol processing using the sector management information or the ECCdata by the memory controller MCNT. Thus, it is possible to contributeto a whole reduction in an access processing time for a file or data.

[7] There is prepared the addressing command (the commands of No. 2, No.3 and No. 4 in FIG. 7) capable of directly specifying the buffer memoryBMRYi mounted on the flash memory chip 1 from the outside. Therefore,the data of the buffer memory BMRYi can be transferred between the i/oand the buffer memory synchronously with the signals REb and WEb.

[8] The page address of a select page (=a page to be operated) is inputto the address buffer in accordance with an addressing command in writeand read modes so that the access address of the flash memory array isdetermined, and furthermore, the address of the on-chip buffer memory isalso decided uniquely. Therefore, an operation for specially carryingout the addressing of the buffer memory is not required.

[9] By preparing the two address latch circuits 30 and 31 and theaddress comparing circuit 32, it is possible to control the cache readoperation by the flash memory itself.

[10] By the background data input represented by such an operation as toinput the next write data to the buffer memory unit during the eraseoperation of the flash memory array FARYi, it is possible to furtherincrease the speed of the rewrite operation of data to the flash memoryarray FARYi.

[11] As described above, it is possible to implement a high-speedrewrite, a cache read and a high-speed copy write and to enhance theconvenience of a flash memory chip. It is possible to improve theperformance of a flash memory card using such a flash memory chip.

While the invention made by the inventor has specifically been describedbased on the examples, the invention is not restricted thereto butvarious changes can be made without departing from the scope of theinvention.

For example, while there has been employed the serial transfer methodfor transferring data on a page unit in series by using the SRAM forcarrying out a byte unit access for the buffer memory, it is alsopossible to use a data latch circuit using a parallel transfer methodcapable of internally transferring the data on the page unit togetherwith the flash memory array.

While the serial clock for writing and reading to and from the buffermemory is prepared for writing (WEb) and reading (REb) separately, it isalso possible to separately prepare a buffer system control command. Inthat case, the serial clock can be shared into one.

The size of the buffer memory may be n pages (n: a natural number whichis greater than 1) or more for each bank.

The invention can also be applied to a binary flash memory in additionto a multivalued, for example, four-valued flash memory. Moreover, thestorage format of the multivalued flash memory is not restricted to thecase in which a threshold voltage is sequentially varied according tothe value of the storage information but there may be employed a memorycell structure utilizing a charge trap film (a silicon nitride film) forlocally changing a place in a memory cell where an electric charge is tobe held and storing information in a multivalue. Furthermore, it is alsopossible to employ another storage format such as a high dielectricmemory cell as a non-volatile memory cell.

Moreover, the invention can also be applied to a non-volatile storagedevice having a singular memory bank. The specification of a buffer unitis not restricted to a tacit specification but a positive specificationmay be carried out in accordance with an address command. However, theinformation content of the address command is increased.

In addition, the invention may employ a structure in which an addressterminal for inputting an address is provided in addition to a structurein which both an address and data are multiplexed and are input to anI/O terminal. It is also possible to have a command for specifyingeither an access to a buffer memory or an access to a flash memory arrayin accordance with the address input from the address terminal. In thiscase, it is also possible to determine an access destination in responseto a control signal for specifying an access to either the buffer memoryor the flash memory. Also in this case, furthermore, it is possible togive an access from the flash memory to the buffer memory on a page unitand to give an access to the buffer memory on a byte unit.

INDUSTRIAL APPLICABILITY

The invention comprises, as an on-chip non-volatile memory, a flashmemory chip having an on-chip buffer memory, a flash memory card capableof mounting the flash memory chip and a flash memory having a buffermemory, and can be widely applied to a semiconductor integrated circuitsuch as a microcomputer or a system LSI.

1. A non-volatile storage device comprising: a plurality of banks; and acontrol unit, wherein the bank has a non-volatile memory unit and abuffer unit corresponding thereto, the non-volatile memory unit of eachbank can carry out an access operation independently, and the controlunit can be caused to control a first access processing between anoutside and the buffer unit and a second access processing between thenon-volatile memory unit and the buffer unit upon receipt of directivesfrom the outside separately from each other, the first access processingincluding an access to one buffer unit, and the second access processingincluding an access to one non-volatile memory unit and an access to aplurality of non-volatile memory units and capable of being caused toselect either of the accesses.
 2. The non-volatile storage device ofclaim 1, wherein the directive of the first access processing serves towrite data input from the outside to the buffer unit or to read datafrom the buffer unit to the outside.
 3. The non-volatile storage deviceof claim 2, wherein the directive for writing or the directive forreading is given by a change in one or a plurality of control signalsinput from the outside.
 4. The non-volatile storage device of claim 3,wherein said non-volatile storage device can output, to the outside,state directive information for indicating that the second accessprocessing is being carried out.
 5. The non-volatile storage device ofclaim 1, wherein said directive of the second access processing is givenin accordance with an access command, and has, as the access command, afirst access command for giving a directive to read data from the bufferunit and to write the data to the non-volatile memory unit, a secondaccess command for giving a directive to read the data from thenon-volatile memory unit and to write the data to the buffer unit, or athird access command for giving a directive to erase the data of thenon-volatile memory unit.
 6. The non-volatile storage device of claim 1,wherein the control unit can recognize an address command supplied fromthe outside, and the control unit recognizes a specification of astorage region of the buffer unit and a storage region of thenon-volatile memory unit in accordance with an address command.
 7. Thenon-volatile storage device of claim 6, wherein said control unitrecognizes a specification of one or a plurality of the buffer units inaccordance with the at least one address command, and gives an access toone or a plurality of the non-volatile memory units corresponding to oneor a plurality of the buffer units specified in accordance with theaddress command through the second access processing.
 8. Thenon-volatile storage device of claim 6, wherein the address command hasfirst specification information, second specification information andthird specification information, the first specification informationspecifying a non-volatile memory unit and tacitly specifying a bufferunit corresponding to the non-volatile memory unit thus specified, thesecond specification information specifying an accessing object addressin the non-volatile memory unit which is specified, and the thirdspecification information specifying an accessing object address of thebuffer unit which is specified.
 9. The non-volatile storage device ofclaim 8, wherein the control unit regards a specification of the bufferunit based on the first specification information as a specification ofanother buffer unit which does not correspond to the non-volatile memoryunit when responding to a specific directive of the second accessprocessing.
 10. The non-volatile storage device of claim 1, wherein thecontrol unit can carry out the second access processing of thenon-volatile memory unit and the first access processing of anotherbuffer unit which does not correspond to the non-volatile memory unit atthe same time.
 11. The non-volatile storage device of claim 1, whereinthe control unit can carry out an erase processing of the non-volatilememory unit and the first access processing of the buffer unit at thesame time.
 12. The non-volatile storage device of claim 1, wherein thecontrol unit maintains storage information of the buffer unit in such astate as to carry out a processing of responding to a directive of thesecond access processing of reading data from the buffer unit andwriting the data to the non-volatile memory unit and to then wait foranother directive of the first access processing or the second accessprocessing.
 13. The non-volatile storage device of claim 1, wherein thecontrol unit maintains storage information of the buffer unit in such astate as to carry out a processing of responding to a directive of thefirst access processing of reading data from the buffer unit andoutputting the data to an outside and to then wait for another directiveof the first access processing or the second access processing.
 14. Thenon-volatile storage device of claim 11, wherein the control unitinitializes storage information of a buffer memory unit in accordancewith a buffer clear command.
 15. The non-volatile storage device ofclaim 12, wherein the control unit initializes storage information ofthe buffer unit before writing data input from the outside to the bufferunit in response to the first access processing when writing the samedata.
 16. The non-volatile storage device of claim 1, wherein thecontrol unit can transfer data read from the non-volatile memory unitand written to the buffer unit through the second access processing atplural times in a different timing from the buffer unit to the outsidethrough the first access processing to be carried out at plural times.17. The non-volatile storage device of claim 1, wherein the control unitomits a second access processing of writing data from the non-volatilememory unit to the buffer unit which sets the same address as that onthe non-volatile memory unit of data retained in the buffer unit to bean access processing object when a directive of the second accessprocessing is given.
 18. The non-volatile storage device of claim 17,further comprising address holding means for holding address informationabout an address on the non-volatile memory unit of the data retained inthe buffer unit, and comparing means for comparing the addressinformation held in the address holding means with address informationabout an address of the non-volatile memory unit which is set to be adata reading object in the second access processing.
 19. Thenon-volatile storage device of claim 17, wherein the control unit variesa period of a busy state based on a signal indicating, as the busystate, that the second access processing is being carried out dependingon presence of the omission of the second access processing when adirective for outputting data written from the non-volatile memory unitto the buffer unit in the second access processing from the buffer unitto the outside is given through the first access processing.
 20. Thenon-volatile storage device of claim 1, wherein the control unit canwrite data written from the outside to the buffer unit by the firstaccess processing at plural times from the buffer unit to thenon-volatile memory unit through the second access processing carriedout at plural times.
 21. The non-volatile storage device of claim 1,wherein the control unit can write data rewritten from the outside ontothe buffer unit by the first access processing carried out at pluraltimes from the buffer unit to the non-volatile memory unit through thesecond access processing.
 22. The non-volatile storage device of claim1, wherein the non-volatile memory unit can store multivaluedinformation of 2 bits or more in one storage element and the buffer unitcan store binary information of 1 bit in one storage element.
 23. Thenon-volatile storage device of claim 22, wherein the control unit canregard storage information of the non-volatile memory unit as binaryinformation and can control a third access processing of omitting aconverting operation from a multivalue to a binary.
 24. The non-volatilestorage device of claim 5, further comprising, on a signal path to beused for the first access processing, an address buffer for latchingaddress information sent from the outside, a buffer unit address bufferfor inputting an output of the address buffer and supplying the outputto the buffer unit, a buffer unit data buffer for latching data outputfrom the buffer unit, and a data buffer for latching data output fromthe buffer unit data buffer and outputting the data to the outside, thecontrol unit generating, as a dummy clock, a latch timing of the bufferunit address buffer and a latch timing of the buffer unit data bufferwhile an address command is recognized synchronously with a first strobesignal and a second strobe signal for giving a directive to read data tothe outside in the first access processing is then changed.
 25. Thenon-volatile storage device of claim 1, wherein the non-volatile memoryunit has an erase unit which is plural times as large as a write unitand each of the buffer units has a storage capacity on the write unit,and the control unit uses both the buffer unit of a bank to be a rewriteobject and the buffer unit of a different bank in a save region ofrewrite object storage information corresponding to a directive of arewrite operation for storage information on the erase unit.
 26. Thenon-volatile storage device of claim 1, wherein said non-volatilestorage device is formed on one semiconductor chip.
 27. The non-volatilestorage device of claim 1, further comprising another circuit module iswholly formed on one semiconductor chip.
 28. A non-volatile storagedevice comprising: a plurality of memory banks; and a control unit, thememory bank having a non-volatile memory unit and a buffer unit,accessing object regions of the buffer unit and the non-volatile memoryunit being specified based on an address command, and the control unitbeing capable of controlling a first access processing of carrying outan access operation between an outside and the buffer unit and a secondaccess processing of carrying out an access operation between thenon-volatile memory unit and the buffer unit upon receipt of directivesfrom the outside separately from each other, and controlling one of thefirst access processing corresponding to one of the second accessprocessing and controlling a plurality of the first access processingscorresponding to one of the second access processing.
 29. Thenon-volatile storage device of claim 28, wherein the control unit iscaused to utilize the buffer unit of the memory bank specified inaccordance with the address command in the first access processing, andis caused to utilize the buffer unit of the memory bank specified inaccordance with the address command or the buffer unit of another memorybank corresponding to contents of a directive in the second accessprocessing.
 30. The non-volatile storage device of claim 28, wherein thecontrol unit controls a read set-up operation for the accessing objectregion of the non-volatile memory unit specified in accordance with anaddress command every time the address command is input within a limitof the number of times of a dependence on the number of the memorybanks, and controls to read storage information from the non-volatilememory unit subjected to the read set-up and to write the storageinformation to the buffer unit when a read access command for giving adirective of a read operation as the second access processing is input.31. The non-volatile storage device of claim 28, wherein the controlunit controls a write operation for write data to the buffer unit of thememory bank specified in accordance with an address command every timethe address command is input and write data are input in accordance witha directive of the first access processing continuously within a limitof the number of times of a dependence on the number of the memorybanks, and carries out a control to write the write data possessed bythe buffer unit to the non-volatile memory unit of the correspondingmemory bank when a write access command for giving a directive of thewrite operation as the second access processing is input.
 32. Thenon-volatile storage device of claim 28, wherein the control unitcontrols an erase operation of a storage region for the non-volatilememory unit of the memory bank specified in accordance with an addresscommand by inputting the address command and then inputting an erasecommand continuously within a limit of the number of times of adependence on the number of the memory banks.
 33. A non-volatile storagedevice comprising: a control unit; a non-volatile storage unit; and abuffer circuit, the non-volatile storage unit being divided into aplurality of non-volatile storage regions, the buffer circuit beingdivided into a plurality of buffer regions corresponding to thenon-volatile storage regions, the control unit accepting a plurality ofoperation directive commands from an outside, the operation directivecommands having: a first operation directive command for giving adirective of an access operation between the buffer circuit and theoutside; and a second operation directive command for giving a directiveof an access operation between the buffer circuit and the non-volatilestorage unit, the first operation directive command giving a directiveof an access operation to the buffer region, and the second operationdirective command capable of selecting either an access operation to thenon-volatile storage region or an access operation to the non-volatilestorage regions.
 34. The non-volatile storage device of claim 33,wherein the control unit has a command accepting state capable ofaccepting the operation directive command, and accepts the operationdirective command to carry out a processing corresponding to eachoperation directive command and then brings the command accepting state.35. The non-volatile storage device of claim 34, wherein the operationdirective command is a third operation directive command for specifyingan address to select the non-volatile storage region, and the secondoperation directive command gives a directive to carry out an accessoperation between the non-volatile storage region which is selected inaccordance with the third operation directive command and the buffercircuit.
 36. The non-volatile storage device of claim 35, wherein thecontrol unit selects the non-volatile storage region in accordance withthe third operation directive command and also selects the buffer regioncorresponding to the non-volatile storage region thus selected, thefirst operation directive command gives a directive for carrying out anaccess operation between the buffer region selected in accordance withthe third operation directive command and the outside, and the secondoperation directive command gives a directive for carrying out an accessoperation between the buffer region and the non-volatile storage regionwhich are selected in accordance with the third operation directivecommand.
 37. The non-volatile storage device of claim 36, wherein thecontrol unit is brought into the command accepting state correspondingto a completion of a part of the access processing to the non-volatilestorage region in accordance with the second operation directivecommand, and before all the access processings to the non-volatilestorage region are completed, can carry out an acceptance of the thirdoperation directive command, and an acceptance of the first or secondoperation directive command when the buffer region and the non-volatilestorage region which are selected in accordance with the third operationdirective command are different from the region in which the accessprocessing is carried out.
 38. The non-volatile storage device of claim37, wherein the first operation directive command includes a first writeoperation command for giving a directive to write data to the buffercircuit and a first read operation command for giving a directive toread data from the buffer circuit, and the second operation directivecommand includes a second write operation command for giving a directiveto write data from the buffer circuit to the non-volatile storage unitand a second read operation command for giving a directive to read datafrom the non-volatile storage unit to the buffer circuit.
 39. Thenon-volatile storage device of claim 38, wherein the first operationdirective command further includes a first erase operation command forgiving a directive to erase data written to the buffer circuit, and thesecond operation directive command further includes a second eraseoperation command for giving a directive to erase data written to thenon-volatile storage unit.
 40. The non-volatile storage device of claim39, wherein after accepting the third operation directive command forspecifying a first non-volatile storage region of the non-volatilestorage unit and then accepting the second erase operation command, andstarting to erase data written to the first non-volatile storage regionand before completing the erase of the data, the control unit can acceptthe third operation directive command for specifying a secondnon-volatile storage region of the non-volatile storage unit and thefirst operation directive command or the second operation directivecommand.
 41. The non-volatile storage device of claim 39, wherein afteraccepting the third operation directive command for specifying a firstnon-volatile storage region of the non-volatile storage unit and thenaccepting the second read command, and completing to read data from thenon-volatile storage unit to the buffer circuit, the control unit canaccept the first operation directive command at least once, andfurthermore, can carry out an operation for accepting the second writecommand.
 42. The non-volatile storage device of claim 41, wherein afteraccepting the second read command and before accepting the second writecommand, the control unit carries out an acceptance of the thirdoperation directive command for specifying a second non-volatile storageregion of the non-volatile storage unit and an acceptance of the firstoperation directive command or the second operation directive command atleast once and can then carry out an operation for accepting the thirdoperation directive command for specifying the first non-volatilestorage region.
 43. The non-volatile storage device of claim 38, whereinthe control unit can carry out an operation for accepting the secondwrite command after accepting the third operation directive command forspecifying the first non-volatile storage region of the non-volatilestorage unit and then accepting the first write command at least once.44. The non-volatile storage device of claim 43, wherein the controlunit can carry out an operation for accepting the first operationdirective command at least once after accepting the first write commandat least once.
 45. The non-volatile storage device of claim 43, whereinthe control unit can carry out the operation for accepting the secondwrite command at least once after accepting the write command at leastonce.
 46. The non-volatile storage device of claim 39, wherein thecontrol unit accepts the second read command after accepting the thirdoperation directive command for specifying a first address included inthe first non-volatile storage region of the non-volatile storage unit,reads data in a first data volume from an address specified inaccordance with the third operation directive command from thenon-volatile storage unit to the buffer circuit in accordance with thesecond read command, and can then accept, at least once, the thirdoperation directive command and the first operation directive commandwhich specify an address included in the first non-volatile storageregion of the non-volatile storage unit and contained in a range of thefirst data volume from the first address.
 47. The non-volatile storagedevice of claim 39, wherein when accepting the second read command afteraccepting the third operation directive command for specifying a firstaddress included in the first non-volatile storage region of thenon-volatile storage unit, reading data in a first data volume from anaddress specified in accordance with the third operation directivecommand from the non-volatile storage unit to the buffer circuit inaccordance with the second read command, and further accepting the thirdoperation directive command for specifying a second address included inthe first non-volatile storage region of the non-volatile storage unitand contained in a range of the first data volume from the firstaddress, and accepting the second read command, the control unit doesnot carry out a read operation from the non-volatile storage unit to thebuffer circuit in a processing of the second read command.
 48. Thenon-volatile storage device of claim 39, wherein the control unit doesnot erase data written to the buffer circuit in a completion of thesecond write command but erases the data written to the buffer circuitin accordance with the first erase operation command.
 49. Thenon-volatile storage device of claim 35, further comprising a firstbuffer region of a buffer circuit which preferentially corresponds to afirst non-volatile storage region and a second buffer region of a buffercircuit which preferentially corresponds to a second non-volatilestorage region, a first buffer region of the buffer circuit beingcapable of carrying out an access operation together with the secondnon-volatile storage region, and a second buffer region of the buffercircuit capable of carrying out an access operation together with thefirst non-volatile storage region.
 50. The non-volatile storage deviceof claim 49, wherein the first operation directive command includes afirst write operation command for carrying out an access operationbetween the first buffer region of the buffer circuit and the outside togive a directive to write data to the buffer circuit, a first readoperation command for giving a directive to read data from the buffercircuit, and a first erase operation command for giving a directive toerase data written to the buffer circuit, and the second operationdirective command includes a second write operation command for carryingout an access operation between the buffer region of the buffer circuitselected in accordance with the third operation directive command andthe non-volatile storage region of the non-volatile storage unit to givea directive to write data from the buffer circuit to the non-volatilestorage unit, a second read operation command for giving a directive toread data from the non-volatile storage unit to the buffer circuit, anda second erase operation command for giving a directive to erase datawritten to the non-volatile storage unit, the second write operationcommand having a main second write operation command for giving adirective to write data to the non-volatile storage region whichpreferentially corresponds to the buffer region of the buffer circuitwhich is selected, and a subordinate second write operation command forgiving a directive to write data to a non-volatile storage region whichis not the non-volatile storage region preferentially corresponding tothe buffer region of the buffer circuit which is selected, and thesecond read operation command having a main second read operationcommand for giving a directive to read data from the non-volatilestorage region which preferentially corresponds to the buffer region ofthe buffer circuit which is selected, and a subordinate second readoperation command for giving a directive to read data from anon-volatile storage region which is not the non-volatile storage regionpreferentially corresponding to the buffer region of the buffer circuitwhich is selected.
 51. The non-volatile storage device of claim 50,wherein data are read or written at a time on a first data volume unitin accordance with the second read command or the second write command,data are erased at a time on a unit of a second data volume which islarger than the first data volume in accordance with the second erasecommand, and when a first address is specified in accordance with thethird operation directive command and a directive of the second erasecommand is given, first data included in an address range having thefirst data volume from the first address are written to the non-volatilestorage region preferentially corresponding to the buffer region of thebuffer circuit which is selected or/and second data sent from a secondaddress which is not included in the address range having the first datavolume from the first address are written to the non-volatile storageregion which is not the non-volatile storage region preferentiallycorresponding to the buffer region of the buffer circuit which isselected.
 52. A non-volatile storage device comprising: a control unit;a non-volatile storage unit; the non-volatile storage unit having aplurality of storage regions, and the same number of buffer circuits asthe number of the storage regions, the buffer circuits being connectedto an outside and being caused to correspond to the storage regions,respectively, the buffer circuits being capable of being accessed to theoutside independently based on a control to be carried out by thecontrol unit, respectively, and one or a plurality of the storageregions being capable of carrying out an access operation independentlytogether with the corresponding buffer circuit based on the control tobe carried out by the control unit.
 53. A non-volatile storage devicecomprising: a non-volatile memory unit; a buffer unit; and a controlunit, the non-volatile memory unit being divided into a plurality ofmemory banks which can independently carry out an access operation,respectively, the buffer unit being divided into a plurality of regionscorresponding to the respective memory banks, and the control unit beingcapable of independently carrying out an access control in accordancewith a directive given from an outside with respect to the non-volatilememory unit and the buffer unit, and giving an access directive to oneor a plurality of the regions of the buffer unit in accordance with thedirective given from the outside and then carrying out an access controlbetween the non-volatile memory unit and the buffer unit with respect toone or a plurality of the memory banks corresponding to one or aplurality of the regions.
 54. A non-volatile storage device comprising:a non-volatile memory unit; a buffer unit; and a control unit, thecontrol unit being capable of controlling a first access processingbetween an outside and the buffer unit, a second access processingbetween the non-volatile memory unit and the buffer unit, and aninitialization processing of the buffer unit upon receipt of directivesfrom the outside separately from each other, and carrying out noinitialization over the buffer unit depending on a completion of thefirst access processing and the second access processing but bringingthe buffer unit into an initializing state depending on theinitialization processing of the buffer unit.
 55. The non-volatilestorage device of claim 54, wherein the non-volatile memory unit has aplurality of non-volatile memory cells, each of the non-volatile memorycells having a first state indicative of an erase state and a secondstate indicative of a write state, and the initializing state of thebuffer unit corresponds to the first state of the non-volatile memorycell.
 56. The non-volatile storage device of claim 55, wherein thenon-volatile memory cell has a threshold voltage, and the state of eachof the non-volatile memory cells is determined depending on whether athreshold voltage of the non-volatile memory cell is included in anerase voltage distribution indicative of the erase state or a writevoltage distribution indicative of the write state.
 57. The non-volatilestorage device of claim 56, wherein the second access processingincludes a data read operation from the non-volatile memory unit to thebuffer unit, the first access processing includes a data outputoperation from the buffer unit to the outside, and the data outputoperation can be carried out at plural times after one data readoperation.
 58. The non-volatile storage device of claim 57, wherein thecontrol unit carries out the initialization processing of the bufferunit before the data read operation.
 59. The non-volatile storage deviceof claim 56, wherein the second access processing includes a data writeoperation from the buffer unit to the non-volatile memory unit, thefirst access processing includes a data input operation from the outsideto the buffer unit, and one data write operation can be carried outafter the data input operation executed at plural times.
 60. Thenon-volatile storage device of claim 59, wherein the control unitcarries out the initialization processing of the buffer unit after thedata write operation.